Page 47 - ASME InterPACK 2017 Program

WEDNESDAY, AUGUST 30 Technical Sessions

CONTINUOUS LIFETIME ESTIMATION OF VEHICLE POWER 1-7-1
ELECTRONICS
Technical Presentation. IPACK2017-74215 THERMAL MANAGEMENT FOR HETEROGENEOUS

Douglas DeVoto, Paul Paret, Kevin Bennion, Eric Miller, Joshua Major, INTEGRATION - I
National Renewable Energy Laboratory, Golden, CO, United States
Second Floor, Mason I 2:15pm – 3:45pm
THE DEPENDENCE OF MOISTURE INDUCED DIE STRESSES
ON THE MOISTURE PROPERTIES OF POLYMERIC COMPO- Session Chair: David Altman, Raytheon Integrated Defense Systems,
NENTS IN ELECTRONIC PACKAGES Framingham, MA, United States
Technical Paper Publication. IPACK2017-74273
Session Co-Chair: Chris Koontz, Raytheon SAS, El Segundo, CA, United
Quang Nguyen, Jeffrey Suhling, Richard Jaeger, Pradeep Lall, Auburn States
University, Auburn, AL, United States
EXPERIMENTAL INVESTIGATION OF ARTIFICIAL CAVITIES ON
PROGNOSTICS: A NEW PARADIGM IN VEHICLE MAINTE- THE THERMAL PERFORMANCE OF A PULSATING HEAT PIPE
NANCE Technical Presentation. IPACK2017-74007
Keynote Presentation. IPACK2017-74449
Wookyoung Kim, Sung Jin Kim, Korea Advanced Institute of Science and
Azeem Sarwar, General Motors, Warren, MI, United States Technology (KAIST), Daejeon, Korea (Republic)

TRACK 7 KEYNOTES PRESSURE DROP AND HEAT TRANSFER CHARACTERISTICS
OF WAVY PLATE FINS FOR THE LOW-REYNOLDS NUMBER
FLOW

Technical Presentation. IPACK2017-74057

Dahm Yu, Sung Jin Kim, KAIST, Daejeon, Korea (Republic)

7-6 OPTIMIZATION OF FILLING MASS FRACTION FOR COMPOSITE
PLENARY LUNCHEON TALKS PCMS BASED THERMAL MANAGEMENT SYSTEM
Technical Paper Publication. IPACK2017-74196

7-6-1 12:30pm – 2:00pm Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing
PLENARY LUNCHEON KEYNOTE Luo, Huazhong University of Science and Technology, Wuhan, China
Third Floor, Grand Ballroom
THERMAL BOUNDARY RESISTANCE-LIMITED PERFORMANCE
Session Chair: Bahgat Sammakia, Binghamton University, Binghamton, OF HIGH-FREQUENCY PHOTODIODES
Technical Presentation. IPACK2017-74309
NY, United States
Patrick Hopkins, John Gaskins, Lei Wang, Ramez Cheaito, Jeffrey
CHALLENGES TO INTEGRATED PHOTONICS MANUFACTUR- Braun, Ashutosh Giri, Ethan Scott, Yang Shen, Joe Campbell, University
ING of Virginia, Charlottesville, VA, United States
Keynote Presentation. IPACK2017-74453
TRACK 2 SERVERS OF THE FUTURE
Michael Liehr, American Institute for Manufacturing (AIM) Photonics,
Albany, NY, United States

TRACK 1 HETEROGENEOUS INTEGRATION: MICRO- Track Chair: Reza Khiabani, Google, Mountain View, CA, United States
SYSTEMS WITH DIVERSE FUNCTIONALITY
Track Co-Chairs: Sandeep Ahuja, Intel, Hillsboro, OR, United States,
Track Chair: Kaushik Mysore, AMD, Austin, TX, United States Yogendra Joshi, Georgia Institute of Technology, Atlanta, GA, United
States, Ryan Enright, Bell Labs Ireland, Dublin, Ireland
Track Co-Chairs: Winston Zhang, Novark Technology Inc., Shenzhen,
Guangdong, China, Ankur Jain, University of Texas at Arlington, Arlington, 2-1
TX, United States DATA CENTERS AND ENERGY EFFICIENT HPC CONCEPTS

1-7 2-1-3 2:15pm – 3:45pm
THERMAL MANAGEMENT FOR HETEROGENEOUS SERVER COOLING 2
INTEGRATION Second Floor, Mason II

Session Chair: Husam A. Alissa, Microsoft, Redmond, WA, United States

Session Co-Chair: Madhuri Narkhede, Intel, Chandler, AZ, United States

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