Page 43 - ASME InterPACK 2017 Program
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WEDNESDAY, AUGUST 30 Technical Sessions
EFFECT OF INTERFACIAL INCOMPATIBILITY ON COPPER Session Chair: Milena Vujosevic, Intel Corporation, San Jose, CA, United
PUMPING AND RELIABILITY OF 3D ELECTRONIC DEVICES States
Technical Presentation. IPACK2017-74308
Session Co-Chair: David Huitink, University of Arkansas, Fayetteville, AR,
Indranath Dutta, Hanry Yang, Washington State University, Pullman, WA, United States
United States, Tae-Kyu Lee, Portland State University, Portland, OR,
United States TAIL-END PROBABILITY PREDICTION OF SOLDER JOINT
RELIABILITY FOR SEMICONDUCTOR PACKAGES WITH A
COPPER INVERSE OPAL SURFACES FOR ENHANCED BOILING LARGE NUMBER OF INPUT VARIABLES BY ADVANCED
HEAT TRANSFER APPROXIMATE INTEGRATION METHOD
Technical Paper Publication. IPACK2017-74090 Technical Presentation. IPACK2017-74070
Hyoungsoon Lee, Chung-Ang University, Seoul, Korea (Republic), Tanmoy Hsiu-Ping Wei, Bongtae Han, University of Maryland, College Park, MD,
Maitra, University College London, London, United Kingdom, James United States
Palko, Chi Zhang, Mehdi Asheghi, Kenneth Goodson, Stanford Universi-
ty, Stanford, CA, United States, Michael T. Barako, NG Next, Northrop KNOWLEDGE BASED QUALIFICATION PROCESS TO EVALU-
Grumman Aerospace Systems, Redondo Beach, CA, United States, ATE VIBRATION INDUCED FAILURES IN ELECTRONIC COMPO-
Yoonjin Won, University of California, Irvine, Irvine, CA, United States NENTS
Technical Paper Publication. IPACK2017-74190
A STUDY OF THE INITIATION SPEED OF THE PALLADIUM,
WITHIN AN ELECTROLESS NICKEL, ELECTROLESS PALLADI- Karumbu Meyyappan, Intel Corp, Portland, OR, United States, Milena
UM AND IMMERSION GOLD (ENEPIG) SYSTEM, WITH REGARD Vujosevic, Intel Corporation, San Jose, CA, United States, QiFeng Wu,
TO SOLDER JOINT RELIABILITY Intel Corporation, Hillsboro, OR, United States, Charles Hill, Pramod
Technical Presentation. IPACK2017-74345 Malatkar, Ryan Parrott, Intel Corporation, Chandler, OR, United States
Rick Nichols, Atotech Deutschland GmbH, Berlin, Germany THERMOMECHANICAL RELIABILITY CHALLENGES & GOALS
AND DESIGN FOR RELIABILITY METHODOLOGIES FOR EV
EFFECTS OF AGING ON THE MICROSTRUCTURAL EVOLUTION SYSTEMS
OF LEAD FREE SACN05 AND DOPED SAC ALLOYS Technical Paper Publication. IPACK2017-74245
Technical Presentation. IPACK2017-74121
David Huitink, University of Arkansas, Fayetteville, AR, United States
Sudan Ahmed, Nianjun Fu, Jeffrey Suhling, Pradeep Lall, Auburn Univer-
sity, Auburn, AL, United States NOVEL PHM CONCEPT FOR FUTURE USE IN SAFETY RELE-
VANT ELECTRONICS FOR HARSH ENVIRONMENT
MECHANICAL CHARACTERIZATION OF SOLDER MASK AT Technical Presentation. IPACK2017-74307
DIFFERENT TEMPERATURES
Technical Presentation. IPACK2017-74261 Przemyslaw Gromala, Robert Bosch Gmbh, Reutlingen, Germany
Promod Chowdhury, Jeffrey Suhling, Pradeep Lall, Auburn University, TRACK 7 KEYNOTES
Auburn, AL, United States
TRACK 5 TRANSPORTATION: AUTONOMOUS & 7-2
ELECTRIC VEHICLES TRACK 2 - KEYNOTE
Track Chair: Milena Vujosevic, Intel Corporation, San Jose, CA, United 7-2-1
States
A SYSTEMS PERSPECTIVE: MAKING THERMAL MANAGEMENT A
Track Co-Chairs: Przemyslaw Gromala, Robert Bosch Gmbh, Reutlingen, FIRST CLASS CITIZEN
Germany, Ercan M. Dede, Toyota Research Institute of North America, Ann
Arbor, MI, United States, Pradeep Lall, Auburn University, Auburn, AL, Second Floor, Jackson 9:15am – 10:15am
United States
A SYSTEMS PERSPECTIVE: MAKING THERMAL MANAGEMENT
5-5 A FIRST CLASS CITIZEN
DEVICE TO SYSTEM LEVEL RELIABILITY Keynote Presentation. IPACK2017-74354
Michael Patterson, Intel, Hillsboro, OR, United States
5-5-1 9:15am – 10:45am 4433
DEVICE, SYSTEM RELIABILITY - I
Second Floor, Mason II
