Page 39 - ASME InterPACK 2017 Program
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TUESDAY, AUGUST 29 Technical Sessions
MEASUREMENT OF ION-MOBILITY IN COPPER-ALUMINUM EFFECTS OF SUSTAINED EXPOSURE TO TEMPERATURE AND
WIREBOND ELECTRONICS UNDER OPERATION AT HIGH HUMIDITY ON THE RELIABILITY AND PERFORMANCE OF
VOLTAGE AND HIGH TEMPERATURE MEMS MICROPHONE
Technical Paper Publication. IPACK2017-74325 Technical Paper Publication. IPACK2017-74252
Pradeep Lall, Yihua Luo, Shantanu Deshpande, Auburn University, Pradeep Lall, Amrit Abrol, Auburn University, Auburn, AL, United States,
Auburn, AL, United States, Luu Nguyen, Texas Instruments Inc., Santa David Locker, US Army RDECOM, Huntsville, AL, United States
Clara, CA, United States
CWDM TRANSCEIVER FOR MID-BOARD OPTICS
MAKING AND QUALIFYING RELIABLE EXTREME ENVIRON- Technical Presentation. IPACK2017-74199
MENT ELECTRONICS
Keynote Presentation. IPACK2017-74351 Sagi Mathai, Hewlett Packard Labs, Palo Alto, CA, United States
Patrick McCluskey, University of Maryland, College Park, MD, United COLOR UNIFORMITY ENHANCEMENT OF WHITE LIGHT-EMIT-
States TING DIODES WITH BELL SHAPE PHOSPHOR LAYER
Technical Paper Publication. IPACK2017-74195
TRACK 1 HETEROGENEOUS INTEGRATION: MICRO- Xingjian Yu, Weicheng Shu, Bofeng Shang, Bin Xie, Yanhua Cheng,
SYSTEMS WITH DIVERSE FUNCTIONALITY Xiaobing Luo, Huazhong University of Science and Technology, Wuhan,
China
Track Chair: Kaushik Mysore, AMD, Austin, TX, United States TRACK 5 TRANSPORTATION: AUTONOMOUS &
ELECTRIC VEHICLES
Track Co-Chairs: Winston Zhang, Novark Technology Inc., Shenzhen,
Guangdong, China, Ankur Jain, University of Texas at Arlington, Arlington, Track Chair: Milena Vujosevic, Intel Corporation, San Jose, CA, United
TX, United States States
1-1 Track Co-Chairs: Przemyslaw Gromala, Robert Bosch Gmbh, Reutlingen,
MICROELECTRONICS AND OPTOELECTRONIC SYSTEMS Germany, Ercan M. Dede, Toyota Research Institute of North America, Ann
INTEGRATION Arbor, MI, United States, Pradeep Lall, Auburn University, Auburn, AL,
United States
1-1-1
5-4
MICROELECTRONICS AND OPTOELECTRONIC SYSTEMS THERMAL MANAGEMENT OF ELECTRIC MOTORS AND
POWER SYSTEMS
INTEGRATION
Second Floor, Montgomery 5:45pm – 7:15pm
Session Chair: Anna Prakash, Intel, Chandler, AZ, United States
Session Co-Chair: Debendra Mallik, Kyle Yazzie, Intel, Chandler, AZ, 5-4-1
United States
THERMAL MANAGEMENT OF ELECTRIC MOTORS AND POWER
EXTENDING THE PERFORMANCE OF HIGH HEAT FLUX 2.5D SYSTEMS – I
AND 3D PACKAGING FROM COMPONENT - SYSTEM INTERAC-
TION Second Floor, Washington 5:45pm – 7:15pm
Technical Presentation. IPACK2017-74262 Session Chair: Vibhash Jha, NXP, Austin, TX, United States
Gamal Rafai-ahmed, Brian Philofsky, Hoa Do, Xilinx, San Jose, CA, Session Co-Chair: Chandradip Patel, Schlumberger Technology Corpora-
United States, Jason Strader, Laird, Cleveland, OH, United States tion, Houston, TX, United States
EVALUATION AND SELECTION OF ADHESIVES FOR OP- ELECTRO-THERMAL SIMULATION OF INTERCONNECTED
TO-ELECTRONIC COMPONENTS SYSTEMS AT TRANSIENT OPERATING CONDITIONS
Technical Presentation. IPACK2017-74342 Technical Paper Publication. IPACK2017-74096
Suriyakala Ramalingam, Kyle Yazzie, Erasenthiran Raaja Poonjolai, Torsten Hauck, NXP Semiconductor, Munich, Germany, John Janssen,
Anna Prakash, Chia-pin Chiu, Intel Corporation, Chandler, AZ, United NXP Semiconductors, Nijmegen, Netherlands, Vibhash Jha, NXP, Austin,
States TX, United States
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