Page 37 - ASME InterPACK 2017 Program
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Committee Meetings
ELECTRONIC & PHOTONIC PACKAGING EXECUTIVE
COMMITTEE MEETING (CLOSED)
TUESDAY, AUGUST 29, 2017 3:00 pm – 4:00 pm
Room: Pyramid Boardroom, Second Floor
This is a closed meeting (by invitation only) of ASME Electronic and Photonic Packaging
Division’s Executive Committee.
INTERPACK 2018 MEETING (OPEN) 6:00 pm – 7:00 pm
WEDNESDAY, AUGUST 30, 2017
Room: Jackson, Second Floor
All are welcome to join! No RSVP necessary. Plans & Logistics for next year’s InterPACK
conference will be discussed at this meeting. Do join if you have any feedback on this year’s
conference, wish to join the organizing team, or simply listen in.
K-16 MEETING (OPEN) 7:00 pm – 8:00 pm
WEDNESDAY, AUGUST 30, 2017
Room: Jackson, Second Floor
This is an open meeting to share updates on the joint packaging and heat transfer division
activities. All are welcome to attend!
INTERPACK IAC MEETING (CLOSED) 7:00 pm – 8:00 pm
WEDNESDAY, AUGUST 30, 2017
Room: Pyramid Boardroom, Second Floor
The InterPACK advisory committee (IAC) will meet to discuss this year’s and future
conference activities. All are welcome to join. However, part of the meeting will be closed
doors (by invitation only).
JOURNAL OF ELECTRONIC PACKAGING MEETING (OPEN)
WEDNESDAY, AUGUST 30, 2017 8:00 pm – 9:00 pm
Room: Jackson, Second Floor
Learn about the exciting developments related to the ASME Journal of Electronic
Packaging!! This is a great opportunity to meet with the Chief Editor, the Associate Editors,
and ask questions. All are welcome to join!
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