Page 40 - ASME InterPACK 2017 Program
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Technical Sessions TUESDAY, AUGUST 29 – WEDNESDAY, AUGUST 30
STEADY STATE AND TRANSIENT THERMAL CHARACTERIZA- TRACK 1 HETEROGENEOUS INTEGRATION: MICRO-
TION OF VERTICAL GAN PIN DIODES SYSTEMS WITH DIVERSE FUNCTIONALITY
Technical Paper Publication. IPACK2017-74149
Track Chair: Kaushik Mysore, AMD, Austin, TX, United States
Georges Pavlidis, Shyh-Chiang Shen, Georgia Institute of Technology,
Atlanta, GA, United States, James Dallas, Sukwon Choi, Pennsylvania Track Co-Chair: Winston Zhang, Novark Technology Inc., Shenzhen,
State University, University Park, PA, United States, Samuel Graham, Guangdong, China, Ankur Jain, University of Texas at Arlington, Arlington,
Georgia Institute of Technology, Lithonia, GA, United States TX, United States
REGULATING BATTERY TEMPERATURE USING A PASSIVE 1-4
THERMAL SWITCH BASED ON SHAPE MEMORY ALLOYS ADDITIVE AND ADVANCED MANUFACTURING
Technical Presentation. IPACK2017-74305
1-4-1 7:30am – 9:00am
Menglong Hao, Chris Dames, UC Berkeley, Berkeley, CA, United States ADDITIVE AND ADVANCED MANUFACTURING
Second Floor, Mason I
PHASE CHANGE MATERIAL (PCM) BASED THERMAL MAN-
AGEMENT FOR LITHIUM ION BATTERIES Session Chair: Abhijit Dasgupta, University of Maryland, College Park,
Technical Presentation. IPACK2017-74344
MD, United States
Yuan Zhao, Mark Amberg, Henkel Electronic Materials, Irvine, CA, United ANALYSIS FOR EVALUATION OF THRESHOLD CURRENT
States DENSITY OF ELECTROMIGRATION DAMAGE IN TA-
PER-SHAPED METAL LINE
WEDNESDAY, AUGUST 30 Technical Paper Publication. IPACK2017-74059
TRACK 8 TECHNOLOGY TALKS Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Hirosaki
University, Hirosaki, Japan
Track Chair: Samuel Graham, Georgia Institute of Technology, Lithonia,
GA, United States AEROSOL-JET PRINTED FILLETS FOR WELL-FORMED ELECTRI-
CAL CONNECTIONS BETWEEN DIFFERENT LEVELED SURFAC-
Track Co-Chair: Kaustubh Nagarkar, GE Ventures, Niskayuna, NY, United ES
States Technical Presentation. IPACK2017-74210
8-5 Yuan Gu, Abhijit Dasgupta, University of Maryland, College Park, MD,
TRACK 5 - TECHNOLOGY TALKS United States
8-5-1 3D PRINTING OF COMPLIANT BGA PADS
Technical Presentation. IPACK2017-74220
THE CHANGING LANDSCAPE OF AUTOMOTIVE ELECTRONICS
Shayandev Sinha, Siddhartha Das, Abhijit Dasgupta, University of
Second Floor, Jackson 7:30am – 8:30am Maryland, College Park, MD, United States
Session Chair: Przemyslaw Gromala, Robert Bosch Gmbh, Reutlingen, RELATIONSHIP BETWEEN THRESHOLD CURRENT DENSITY
Germany OF ELECTROMIGRATION DAMAGE CONSIDERING VOID AND
HILLOCK FORMATION AND RESERVOIR SHAPE IN INTERCON-
Session Co-Chair: Ercan M. Dede, Toyota Research Institute of North NECT LINE
America, Ann Arbor, MI, United States
Technical Paper Publication. IPACK2017-74092
HIGH PERFORMANCE SILICON CARBIDE POWER PACKAGING: Ryuji Takaya, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Takeshi Moriwaki,
PAST TRENDS, PRESENT PRACTICES, AND FUTURE DIREC- Hirosaki University, Hirosaki, Japan
TIONS
Keynote Presentation. IPACK2017-74362 CHALLENGES IN 3D PRINTING OF HIGH CONDUCTIVITY
COPPER
H. Alan Mantooth, University of Arkansas, Fayetteville, AR, United States Technical Paper Publication. IPACK2017-74306
CHALLENGES AND OPPORTUNITIES OF COOPERATING WITH Tahany El-Wardany, Ying She, Jacquelynn Garofano, Wayde Schmidt,
FAST MOVING STARTUPS IN THE AUTOMOTIVE SPACE Vijay Jagdale, Joe Liou, United Technologies Research Center, East
Keynote Presentation. IPACK2017-74363 Hartford, CT, United States
Yvonne Lutsch, Robert Bosch LLC, Palo Alto, CA, United States
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