Page 58 - ASME InterPACK 2017 Program
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Technical Sessions THURSDAY, AUGUST 31
2-2-2 TRACK 4 ENERGY CONVERSION & STORAGE
MODELING AND SIMULATION AT THE SERVER TO DATA CENTER Track Chair: Sreekant Narumanchi, National Renewable Energy Labora-
tory, Golden, CO, United States
LEVEL
Track Co-Chairs: Lauren M. Boteler, U.S. Army Research Laboratory,
Second Floor, Mason I 2:15pm – 3:45pm Adelphi, MD, United States, Patrick McCluskey, University of Maryland,
College Park, College Park, MD, United States, Martin Kuball, HH Wills
Session Chair: Sami Alkharabsheh, Binghamton University, Binghamton, Physics Laboratory, Bristol, United Kingdom
NY, United States
4-1
Session Co-Chair: Aaron Wemhoff, Villanova University, Villanova, PA, POWER ELECTRONICS WIDE BAND GAP
United States, Raphael Okereke, Microsoft Corporation, Redmond, WA, SEMICONDUCTORS, PACKAGING, MODULE ASSEMBLY
AND THERMAL MANAGEMENT
United States
KNOWLEDGE BASED REQUIREMENT CALCULATION FOR
SERVER BGAS TEMPERATURE CYCLING (TC) QUALIFICATION
Technical Paper Publication. IPACK2017-74081
Min Pei, Intel, Hillsboro, OR, United States, Milena Vujosevic, Intel 4-1-3 2:15pm – 3:45pm
Corporation, San Jose, CA, United States, Sibasish Mukherjee, Intel WIDE-BANDGAP DEVICES AND PACKAGING - III
Corporation, Chandler, AZ, United States Second Floor, Mason II
CFD OPTIMIZATION OF 3D MANIFOLDS FOR ENHANCED Session Chair: Jungwan Cho, Kyunghee University, Yongin, Gyeonggi-do,
PERFORMANCE OF FORCED AIR COOLING SYSTEMS Korea (Republic)
Technical Presentation. IPACK2017-74188
Session Co-Chair: Douglas DeVoto, National Renewable Energy
William Libeer, Chirag Kharangate, Srilakshmi Lingamneni, James Laboratory, Golden, CO, United States
Palko, Mehdi Asheghi, Kenneth Goodson, Stanford University, Stanford,
CA, United States THERMAL EVALUATION OF CHIP-SCALE PACKAGED GALLIUM
NITRIDE TRANSISTORS
PERFORMANCE EVALUATION OF THREE TYPES OF NOVEL
END-OF-AISLE COOLING SYSTEMS Keynote Presentation. IPACK2017-74374
Technical Paper Publication. IPACK2017-74016
David Reusch, Efficient Power Conversion, Blacksburg, VA, United States
Manasa Sahini, Dereje Agonafer, University of Texas at Arlington, ELECTROTHERMAL ANALYSIS OF THE FIELD-PLATED ALGAN/
Arlington, TX, United States, Vijayalan Pandiyan, Future Facilities Ltd, San GAN HEMTS WITH SIO2 PASSIVATION
Jose, CA, United States Technical Paper Publication. IPACK2017-74125
COMPARISON AND EVALUATION OF DIFFERENT MONITOR- Dogacan Kara, F. Nazli Donmezer Akgun, Middle East Technical Universi-
ING METHODS IN A DATA CENTER ENVIRONMENT ty, Ankara, Turkey
Technical Paper Publication. IPACK2017-74105
IMPACT OF BUFFER LAYERS ON THE RELIABILITY OF GAN ON
Mohammad Tradat, Sadegh Khalili, Bahgat Sammakia, Binghamton SI HEMTS FOR POWER ELECTRONICS
University – SUNY, Binghamton, NY, United States, Mahmoud Ibrahim, Technical Presentation. IPACK2017-74152
Thomas M. Peddle, Andrew Calder, Bruce Dawson, Panduit Corporation,
Tinley, IL, United States, Mark J. Seymour, Future Facilities, London, Luke Yates, Georges Pavlidis, Georgia Institute of Technology, Atlanta,
London, United Kingdom, Husam A. Alissa, Microsoft, Redmond, WA, GA, United States, Samuel Graham, Georgia Institute of Technology,
United States, Kourosh Nemati, Future Facilities, San Jose, CA, United Lithonia, GA, United States
States
INVESTIGATION OF THE HETEROGENEOUS THERMAL
IMPACT OF TILE DESIGN ON THERMAL PERFORMANCE OF CONDUCTIVITY BULK CVD DIAMOND FOR USE IN ELECTRON-
OPEN AND ENCLOSED AISLES ICS THERMAL MANAGEMENT
Technical Paper Publication. IPACK2017-74339 Technical Paper Publication. IPACK2017-74163
Sadegh Khalili, Mohammad Tradat, Bahgat Sammakia, Binghamton Luke Yates, Zhe Cheng, Thomas Bougher, Georgia Institute of Technolo-
University – SUNY, Binghamton, NY, United States, Kourosh Nemati, gy, Atlanta, GA, United States, Ramez Cheaito, Aditya Sood, Mehdi
Future Facilities, San Jose, CA, United States, Mark J. Seymour, Future Asheghi, Kenneth Goodson, Stanford University, Stanford, CA, United
Facilities, London, London, United Kingdom States, Mark Goorsky, University of California, Los Angeles, Los Angeles,
CA, United States, Firooz Faili, Daniel Twitchen, Element Six Technolo-
58 gies, Santa Clara, CA, United States, Samuel Graham, Georgia Institute of
Technology, Lithonia, GA, United States
