Page 60 - ASME InterPACK 2017 Program

Technical Sessions THURSDAY, AUGUST 31

STATE OF THE ART OF ELECTRONICS COOLING FOR RADAR CURRENT AND FUTURE DIRECTIONS IN POWER ELECTRONIC
ANTENNA APPLICATIONS DEVICES AND CIRCUITS BASED ON WIDE BAND-GAP SEMI-
Technical Paper Publication. IPACK2017-74080 CONDUCTORS
Keynote Presentation. IPACK2017-74377
Girish Upadhya, Clayton Pullins, Karl Freitag, George Hall, Jim
Marthinuss, Northrop Grumman, Linthicum, MD, United States Isik Kizilyalli, Advanced Research Projects Agency - Energy, Washington,
D.C., DC, United States
THE EFFECT OF SURFACE TEXTURE ON THERMAL SENSA-
TION AND COMFORT GaN TRANSISTORS - ENABLING THE NEXT GENERATION OF
Technical Paper Publication. IPACK2017-74179 POWER ELECTRONICS
Keynote Presentation. IPACK2017-74378
Han Zhang, Amazon, Cupertino, CA, United States, Alan Hedge, Cornell
University, Ithaca, NY, United States David Reusch, Efficient Power Conversion, Blacksburg, VA, United States

THIN THERMAL GROUND PLANES FOR HIGH POWER-DENSI- THERMAL MANAGEMENT OF WBG DEVICES - CHALLENGES
TY APPLICATIONS AND OPTIONS
Technical Presentation. IPACK2017-74123 Keynote Presentation. IPACK2017-74379

Shanshan Xu, Ryan Lewis, Jiran Li, Yung Cheng Lee, University of Avram Bar-Cohen, Raytheon, Rosslyn, VA, United States
Colorado, Boulder, CO, United States Luu Nguyen, Texas Instruments Inc.,
Santa Clara, CA, United States TRUE 3D POWER PACKAGING - HIGHER DENSITIES THROUGH
ORTHOGONALITY
QUASI BALLISTIC THERMAL TRANSPORT IN INGAAS ALLOY Keynote Presentation. IPACK2017-74380
Technical Presentation. IPACK2017-74360
Douglas Hopkins, NC State University, Raleigh, NC, United States
Amir Ziabari, Yi Xuan, Doosan Back, Ali Shakouri, Purdue University,
West Lafayette, IN, United States, Pol Torres, Xavier Alvarez, Universitat SYSTEM CONSIDERATIONS FOR FULL UTILIZATION OF SiC
de Autonoma Barcelona, Barcelona, Spain Je-Hyeong Bahk, University of POWER MODULES
Cincinnati, Cincinnati, OH, United States Keynote Presentation. IPACK2017-74387

INVERSE CONDUCTION HEAT TRANSFER AND KRIGING Ty McNutt, Wolfspeed, Fayetteville, AR, United States
INTERPOLATION APPLIED TO TEMPERATURE SENSOR
LOCATION IN MICROCHIPS APPLICATION OF WBG POWER INVERTERS TO VEHICLE
Technical Paper Publication. IPACK2017-74224 SYSTEMS FOR HARSH ENVIRONMENTS
Keynote Presentation. IPACK2017-74406
David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua,
Purdue University, West Lafayette, IN, United States John Oenick, John Deere, Moline, IL, United States

TRACK 9 PANELS TRACK 10 WORKSHOPS

9-4 1 0 -2
TRACK 4 - PANEL MAKER WORKSHOP

9-4-1 1 0 -2 -2
HOW TO CONDUCT A MAKER WORKSHOP
WIDE-BANDGAP PACKAGING, THERMAL MANAGEMENT AND Fourth Floor, Mason II 4:15pm – 5:45pm

APPLICATIONS

Second Floor, Jackson 4:15pm – 5:45pm Session Chair: Priyanka Dobriyal, Intel, Phoenix, AZ, United States

Session Chair: Lauren M. Boteler, U.S. Army Research Laboratory, TRACK 5 TRANSPORTATION: AUTONOMOUS &
Adelphi, MD, United States ELECTRIC VEHICLES

Session Co-Chair: Patrick McCluskey, University of Maryland, College Track Chair: Milena Vujosevic, Intel Corporation, San Jose, CA, United
Park, College Park, MD, United States States

Track Co-Chairs: Przemyslaw Gromala, Robert Bosch Gmbh, Reutlingen,

60 Germany, Ercan M. Dede, Toyota Research Institute of North America, Ann
Arbor, MI, United States, Pradeep Lall, Auburn University, Auburn, AL,

United States