Page 64 - ASME InterPACK 2017 Program
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Technical Sessions THURSDAY, AUGUST 31
ENHANCING DIRECT / INDIRECT EVAPORATIVE HEAT EX- MOISTURE INDUCED STRESSES IN PBGA PACKAGES
CHANGER IN DATA CENTER COOLING IN HARSH CLIMATES Poster Presentation. IPACK2017-74313
BY USING A COMPRESSION REFRIGERATION CYCLE
Poster Presentation. IPACK2017-74327 Jun Chen, Quang Nguyen, Jordan Roberts, Jeffrey Suhling, Richard
Jaeger, Pradeep Lall, Auburn University, Auburn, AL, United States
Ahmed Abuklam, Jeffrey Luttrell, Dereje Agonafer, University of Texas
at Arlington, Arlington, TX, United States DEVELOPMENT OF ANAND VISCOPLASTICITY PARAMETERS
FOR HIGH STRAIN RATE MECHANICAL BEHAVIOR OF SACQ
EFFICIENT LOSS CALCULATION IN PERMANENT MAGNET SOLDER
SYNCHRONOUS MOTORS Poster Presentation. IPACK2017-74257
Poster Presentation. IPACK2017-74209
Pradeep Lall, Vikas Yadav, Jeffrey Suhling, Auburn University, Auburn
Jaewook Lee, Gwangju Institute of Science and Technology (GIST), University, AL, United States, David Locker, US Army RDECOM, Huntsville,
Gwangju, Korea (Republic), Hyeoncheol Jin, Korea Aerospace University, AL, United States
Goyang, Korea (Republic)
STEADY STATE AND TRANSIENT THERMAL CHARACTERIZA-
MECHANICAL BEHAVIOR OF LEAD FREE SOLDERS AT HIGH TION OF VERTICAL GAN PIN DIODES
TEMPERATURES Poster Presentation. IPACK2017-74151
Poster Presentation. IPACK2017-74229
Georges Pavlidis, Georgia Institute of Technology, Atlanta, GA, United
Mohammad Alam, Jeffrey Suhling, Pradeep Lall, Auburn University, States, Samuel Graham, Georgia Institute of Technology, Lithonia, GA,
Auburn, AL, United States United States
SELF-DRIVING COOLING LOOP USING LIQUID METAL AND CHARACTERIZATION OF MOISTURE INDUCED DIE STRESSES
VOLATILE FLUID AS HYBRID COOLANT IN FLIP CHIP PACKAGING
Poster Presentation. IPACK2017-74065 Poster Presentation. IPACK2017-74246
Jianbo Tang, Tsinghua University, Beijing, China, Xi Zhao, Yuan Zhou, Quang Nguyen, Jordan Roberts, Jeffrey Suhling, Richard Jaeger,
Key Laboratory of Cryogenics, Technical Institute of Physics and Chemis- Pradeep Lall, Auburn University, Auburn, AL, United States
try, Chinese Academy of Scien, Beijing, China, Jing Liu, Tsinghua
University, Beijing, China CHANGE IN CHEMICAL STRUCTURE OF STRUCTURAL
ADHESIVE UNDER HIGH TEMPERATURE AND HUMIDITY
EXPERIMENTAL EVALUATION ON COOLING CAPACITY OF CONDITIONS
ELECTRICALLY DRIVEN HYBRID LIQUID METAL AND WATER Poster Presentation. IPACK2017-74035
COOLING
Poster Presentation. IPACK2017-74102 Yugo Tomita, Ikuo Shohji, Shinji Koyama, Gunma University, Kiryu,
Gunma, Japan, Seigo Shimizu, Fuji Heavy Industries Ltd., Ota, Gunma,
Xiao-Hu Yang, Zhizhu He, Bin Yuan, Jing Liu, Technical Institute of Japan
Physics and Chemistry, Chinese Academy of Sciences, Beijing, China,
Si-Cong Tan, CORROSION BEHAVIOR OF COPPER-BASED HEAT PIPE MATE-
RIALS IN AQUEOUS PROPYLENE GLYCOL WITH RUST INHIBI-
METHODS FOR SURVIVABILITY ASSURANCE OF FINE PITCH TOR
ELECTRONICS SUBJECTED TO MECHANICAL SHOCK UP TO Poster Presentation. IPACK2017-74038
25,000G
Poster Presentation. IPACK2017-74323 Kazunari Higuchi, Ikuo Shohji, Shinji Koyama, Gunma University, Kiryu,
Japan, Tetsuya Ando, Muroran Institute of Technology, Muroran, Japan,
Pradeep Lall, Kalyan Dornala, Jeffrey Suhling, Auburn University, Auburn Yoshikazu Mizutani, Yukio Inoue, Showa Industries, Gifu, Japan
University, AL, United States, John Deep, Air Force Research Laboratory,
Eglin, FL, United States IMPROVED FINITE ELEMENT MODELING STRATEGIES FOR
BGA PACKAGES SUBJECTED TO THERMAL CYCLING
EFFECTS OF CYCLIC THERMAL AND MECHANICAL LOADING Poster Presentation. IPACK2017-74230
ON RELIABILITY OF SOLDER BASED INTERCONNECTS
Poster Presentation. IPACK2017-74240 Chienchih Chen, Jeffrey Suhling, Pradeep Lall, Auburn University,
Auburn, AL, United States
Cody Marbut, David Huitink, Jonathan Treco, Arie Smith, Ange
Iradukunda, Mahsa Montazeri, University of Arkansas, Fayetteville, AR,
United States
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