Page 95 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Ooi Junya 1-3-2 IPACK2017-74177
Oppermann Hermann 2-3-1 In-situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue IPACK2017-74122
Ormston Geoffrey S. 4-3-1 Cracks at Die-attached Joints under Cyclic Energization Loading IPACK2017-74147
Osterman Michael 1-3-1 Dual-Side Heat Removal by Micro-Channel Cold Plate and Silicon-Interposer with IPACK2017-74249
Otto Alexander 5-7-1 Embedded Fluid Channels IPACK2017-74208
Ouyang Eric 1-5-1 High Performance Microchannels Development Using Magnetic Stabilization IPACK2017-74026
Ozkan Alican 3-2-1 IPACK2017-74178
Özsun Özgür 2-3-1 Effect of Corner Staking on the Fatigue Life of BGA under Thermal Cycling IPACK2017-74122
Pahinkar Darshan 4-1-5 IPACK2017-74235
Palczynska Alicja 3-3-2 Application Driven Reliability Research of Next Generation for Automotive IPACK2017-74058
Palko James 1-2-1 Electronics: Challenges and Approaches IPACK2017-74090
Palko James 2-2-1 Large Flip Chip Assembly Challenges and Risk Mitigation Process IPACK2017-74088
Palko James 2-2-2 IPACK2017-74188
Palko James 4-1-4 Silica Nanoparticle Formation by Using Droplet-Based Microreactor IPACK2017-74008
Palko James 6-1-1 IPACK2017-74009
Dual-Side Heat Removal by Micro-Channel Cold Plate and Silicon-Interposer with
Palko James 6-1-1 Embedded Fluid Channels IPACK2017-74089
Palko James 6-1-1 Integrated Substrate - Cold Plate for Compact Power Electronics Modules IPACK2017-74189
Pandiyan Vijayalan 2-2-2 IPACK2017-74016
Paniagua Guillermo 1-7-3 Piezoresistive Silicon Stress Sensor as a Tool to Monitor Health of an Electronic IPACK2017-74224
Paret Paul 4-2-1 System IPACK2017-74214
Paret Paul 5-5-2 Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer IPACK2017-74215
Parikh Sarah 9-6-1 IPACK2017-74421
Park Seungbae 1-3-3 Comprehensive Modeling of Single Bubble Evaporation in Microchannel IPACK2017-74017
Parrott Ryan 5-5-1 IPACK2017-74190
Parsa Maryam 6-1-1 CFD Optimization of 3D Manifolds for Enhanced Performance of Forced Air IPACK2017-74361
Patel Chandradip 5-2-1 Cooling Systems IPACK2017-74286
Patel Jaykishanku- 2-1-1 Thermofluidic Characterization of An "Embedded Microchannel-3D manifold" IPACK2017-74207
Patel mar 4-3-2 Cooling Module for High Heat Flux (1 kW/cm2) Power Electronics Application IPACK2017-74243
Pathak Viral 4-4-2 Overcoming Challenges in Microfabrication of Si and SiC-based "Embedded IPACK2017-74078
Chintan Microchannel-3D manifold" Cooling Module for High Heat Flux (1 kW/cm2) Power
Electronics Application
Enhanced Boiling Performance in Hierarchical bi-Porous Surfaces

CFD Optimization of 3D Manifolds for Enhanced Performance of Forced Air
Cooling Systems
Performance Evaluation of Three Types of Novel End-Of-Aisle Cooling Systems

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Tempera-
ture Sensor Location in Microchips
Thermomechanical Modeling and Material Characterization of Sintered Silver

Continuous Lifetime Estimation of Vehicle Power Electronics

Women in STEM Education Panel (Sarah Parikh)

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC
Package during Solder Reflow
Knowledge Based Qualification Process to Evaluate Vibration Induced Failures Ii
Electronic Components
Sub-Diffraction Thermoreflectance Imaging of Nanoscale Metal Interconnects

Advancements in Silver Wire Bonding

Thermal Mixing of Ambient Air and Return Air Streams in a Mixing Chamber for
Data Center Cooling
Thermoelectric Clothes Dryer Development and Performance Evaluation

Minimizing Capacity Fade through Optimal Model-based Control - Theory and
Experimental Validation

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