Page 100 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Sheats Jayna 3-4-1 Integrated Circuits Post-Moore's Law Scaling IPACK2017-74352

Shen Alexandre 2-1-4 Thermo-optic Tuning Efficiency of Micro Ring Resonators on Low Thermal IPACK2017-74181
Shen Alexandre 6-2-1 Resistance Silicon Photonics Substrates IPACK2017-74217
Shen Shyh-Chiang 4-1-1 IPACK2017-74153
Integrated Micro-Thermoelectric Cooling for Silicon Photonics: Modeling and
Fabrication by Template-Assisted Electrochemical Deposition

Thermal Characterization of GaN based Vertical Power Electronic Devices

Shen Shyh-Chiang 5-4-1 Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes IPACK2017-74149

Shen Yang 1-7-1 Thermal Boundary Resistance-limited Performance of High-Frequency Photodi- IPACK2017-74309
Shimizu Seigo 6-1-1 odes IPACK2017-74035
Shin Seungha 1-5-2 IPACK2017-74115
Shin Seungha 1-5-2 Change in Chemical Structure of Structural Adhesive under High Temperature and IPACK2017-74114
Shin Seungha 1-5-2 Humidity Conditions IPACK2017-74111
Shin Seungha 2-2-1 IPACK2017-74113
Joining of Cu-Ag Core-Shell Nanoparticles and Nanowires at Room Temperature:
A Molecular Dynamics Study

Sintering Dynamics and Sintered Structure Properties of Multiple Cu-Ag
Core-Shell Nanoparticles

A Molecular Dynamics Study of Geometrical and Temperature Effects on Sintering
of Two Cu-Ag Core-Shell Nanoparticles

Diversion of heat flow in supported graphene nanomeshes

Shin Seungha 2-3-2 Control of thermal transport in graphene/Si heterostructures IPACK2017-74109

Shishido Nobuyuki 4-1-3 Effect of Material Non-linearity on Thermal Fatigue Reliability for Aluminum Wire IPACK2017-74176
Shohji Ikuo 6-1-1 Bonds of Power Module IPACK2017-74032
Shohji Ikuo 6-1-1 IPACK2017-74036
Shohji Ikuo 6-1-1 Temperature Dependency of Adhesion Strength of Resin/Cu Interface and its IPACK2017-74035
Shohji Ikuo 6-1-1 Degradation Mechanism under Aging IPACK2017-74038
Shu Weicheng 1-1-1 IPACK2017-74195
Siddarth Ashwin 2-1-1 Effect of Surface Finish of Cu Electrode on Characteristics of High Melting Point IPACK2017-74207
Siddarth Ashwin 2-1-2 Joint Using Sn-57Bi-1Ag IPACK2017-74028
Siddarth Ashwin 2-1-3 IPACK2017-74288
Siddarth Ashwin 6-1-1 Change in Chemical Structure of Structural Adhesive under High Temperature and IPACK2017-74434
Singh Ankit 3-3-1 Humidity Conditions IPACK2017-74143

Corrosion Behavior of Copper-Based Heat Pipe Materials in Aqueous Propylene
Glycol with Rust Inhibitor

Color Uniformity Enhancement of White Light-emitting Diodes with Bell Shape
Phosphor Layer

Thermal Mixing of Ambient Air and Return Air Streams in a Mixing Chamber for
Data Center Cooling

Characterization of an Isolated Hybrid Cooled Server with Failure Scenarios Using
Warm Water Cooling

Impact of Static Pressure Differential between Supply Air and Return Exhaust on
Server Level Performance

Impact of Static Pressure Differential Between Supply Air and Return Exhaust on
Server Level Performance

ALD Barrier Films for Protecting Electronics in Harsh Environments

Singh Yuvraj 1-3-1 Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder IPACK2017-74201
Sinha Shayandev 1-4-1 Alloy IPACK2017-74220

3D printing of compliant BGA pads

Sitaraman Suresh 5-7-2 Methods for Theoretical Assessment of Delamination Risks in Electronic IPACK2017-74073
6-1-1 Packaging IPACK2017-74240
Smith Arie 4-3-2 IPACK2017-74318
6-1-1 Effects of Cyclic Thermal and Mechanical Loading on Reliability of Solder Based IPACK2017-74315
So Hongyun 1-7-2 Interconnects IPACK2017-74175

So Hongyun Temperature-dependent Thermoelectric Properties of AlGaN/GaN Films Grown
on Inverted Pyramid Si Structures
Sood Aditya
100 Rapid Prototyping of High-temperature Multi-functional AlGaN/GaN Sensors using
Laser Ablation and Direct Wire Bonding

Micron Scale Spatial Resolution of the Thermal Conductivity across Grain
Boundaries of Bulk Diamond Using Time-Domain Thermoreflectance