Page 104 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Wang Hao 4-3-1 IPACK2017-74415
Wang Jiaqi 1-5-2 A Photonic Near Infrared Radiative Heater IPACK2017-74115
Wang Jiaqi 1-5-2 IPACK2017-74114
Wang Jiaqi 1-5-2 Joining of Cu-Ag Core-Shell Nanoparticles and Nanowires at Room Temperature: IPACK2017-74111
Wang Jing 1-3-3 A Molecular Dynamics Study IPACK2017-74017
Wang Lei 1-7-1 Sintering Dynamics and Sintered Structure Properties of Multiple Cu-Ag IPACK2017-74309
Wang Lei 1-7-2 Core-Shell Nanoparticles IPACK2017-74310
Wang Shan 6-1-1 A Molecular Dynamics Study of Geometrical and Temperature Effects on Sintering IPACK2017-74050
Warzoha Ronald 10-3-1 of Two Cu-Ag Core-Shell Nanoparticles IPACK2017-74444
Wei Hsiu-Ping 1-3-3 An Investigation of Moisture-induced Interfacial Delamination in Plastic IC IPACK2017-74071
Package During Solder Reflow
Wei Hsiu-Ping 5-5-1 Thermal Boundary Resistance-Limited Performance of High-Frequency IPACK2017-74070
Photodiodes
Weihe Stefan 5-7-1 Thermal Conductivity Measurements of Non-Metals Via Combined Time- and IPACK2017-74416
Frequency-Domain Thermoreflectance without a Metal Film Transducer
Welschinger Fabian 5-7-2 Thermal Conductance of Ultrathin CoFeB and MgO films in Magnetic Tunnel IPACK2017-74104
2-3-1 Junction Characterized by Picosecond Time-domain Thermoreflectance IPACK2017-74292
Wen Rongfu 4-1-5 Prof. Ron Warzoha IPACK2017-74132
6-1-1 IPACK2017-74050
Weyant Jens 1-5-1 Statistical Model Calibration for Semiconductor Packages with a Large Number of IPACK2017-74436
4-3-2 Input Variables by Approximate Integration Method with Advanced Objective IPACK2017-74248
White Robert M 1-2-1 Function IPACK2017-74090
6-1-1 IPACK2017-74368
Williams Shelley 1-6-1 Tail-End Probability Prediction of Solder Joint Reliability for Semiconductor IPACK2017-74002
4-4-2 Packages with a Large Number of Input Variables by Advanced Approximate IPACK2017-74197
Wolden Colin 1-3-3 Integration Method IPACK2017-74048
1-5-1 IPACK2017-74266
Won Yoonjin 6-1-1 Towards Improvement of Lifetime Prediction of Solder Joints under Field IPACK2017-74241
5-5-1 Conditions: Accelerated Thermo-Mechanical Fatigue Measurement on Realistic IPACK2017-74190
Won Yoonjin 1-7-1 BGA-Geometry IPACK2017-74196
1-1-1 IPACK2017-74195
Wong Tse 1-7-1 Modeling Thermo-mechanically Driven Fracture Processes Ii Bulk Mold Material of IPACK2017-74196
Electro Mechanical Components
Wood, III David Capillary Evaporation in 4-layer Copper Mesh Structure

Wu Bulong Integrated Vapor Chamber Heat Spreader for Power Module Applications

Wu Jing Thermal Conductance of Ultrathin CoFeB and MgO films in Magnetic Tunnel
Junction Characterized by Picosecond Time-domain Thermoreflectance
Wu Jing Metallurgical Analyses of Pin-to-Flex Circuit Solder Joints

Wu QiFeng Role of Packaging in Enabling High Specific Power and Flexible Photovoltaics

Wu Ruikang Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer

Xie Bin Thin Film Evaporation within Microscale Pores

104 Xie Bin Embedded 3D RF Package with Superior Cooling and Load Carrying Mechanisms

Pushing the Envelope on Batteries: New Advanced Cathode Materials and their
Problems
Effect of Underfill on Thermo-Mechanical Behavior of Fan-out WLP: An Experi-
mental Study by Advanced Moiré Interferometry
Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead
Free Solder
Quantitative Analysis of Aging Induced Evolution of IMCs in SAC305 Lead Free
Solder
Knowledge based qualification process to evaluate vibration induced failures in
Electronic Components
Optimization of Filling Mass Fraction for Composite PCMs Based Thermal
Management System
Color Uniformity Enhancement of White Light-emitting Diodes with Bell Shape
Phosphor Layer
Optimization of Filling Mass Fraction for Composite PCMs Based Thermal
Management System