Page 107 - ASME InterPACK 2017 Program

ASME Leadership

INFORMATION STORAGE & PROCESSING SYSTEMS DIVISION LEADERSHIP

ELECTRONIC & PHOTONIC PACKAGING
DIVISION LEADERSHIP

Chair Kaustubh Nagarkar, GE
Vice Chair Mehdi Asheghi, Stanford University
Treasurer Milena Vujosevic, Intel
Secretary Amy Fleischer, Villanova University
Member-at-Large Kaushik Mysore, AMD

DESIGN MATERIALS AND MANUFACTURING SEGMENT LEADERSHIP

Chair Tim Simpson, Penn State
TEC Rep Gloria Wiens, FloridaMakes
Member Andrew Alleyne, University of Illinois
Member Stephen Reese, Idaho National Laboratory
Member Larry Dickinson, 3F LLC
Member Abhijit Dasgupta, University of Maryland
Member Y. F. Pang, Intel
Member K. Subramanian, Virginia Tech
ASME Staff Raj Manchanda
ASME Staff Israr Kabir
ASME Staff John Grimes
ASME Staff Mary Jakubowski, CMP

2015-2016 ASME OFFICERS

President Charla C. Wise

Past President K. Keith Roe

President-Nominee/Elect Said Jahanmir

Executive Director Thomas Loughlin

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