Page 103 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Thomas Tony 6-1-1 IPACK2017-74274
Thome John Richard 2-1-1 Reliability of SAC Solders under Combined Temperature-Vibration Automotive IPACK2017-74020
Thome John Richard 2-1-1 Environments IPACK2017-74030
Tomita Yugo 6-1-1 Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for IPACK2017-74035
Tonozuka Yu 6-1-1 Electronics: Experimental Analysis IPACK2017-74032
Torres Pol 1-7-3 Two-Phase Mini-thermosyphon for Cooling of Datacenters: Experiments, IPACK2017-74360
Tradat Mohammad 2-1-1 Modeling and Simulations IPACK2017-74148
Tradat Mohammad 2-2-2 Change in Chemical Structure of Structural Adhesive under High Temperature and IPACK2017-74105
Tradat Mohammad 2-2-2 Humidity Conditions IPACK2017-74339
Treco Jonathan 6-1-1 Temperature Dependency of Adhesion Strength of Resin/Cu Interface and its IPACK2017-74240
Tsai Ming-Yi 1-5-1 Degradation Mechanism under Aging IPACK2017-74012
Tsuritani Hiroyuki 1-3-2 Quasi Ballistic Thermal Transport in InGaAs Alloy IPACK2017-74177
Tuominen Risto 6-2-1 IPACK2017-74428
Turlapati Lavanya 3-3-2 Transient Thermal Performance of Rear Door Heat Exchanger with Local IPACK2017-74304
Twitchen Daniel 4-1-3 Contained Cold Aisle During Water Side Failures IPACK2017-74163
Twitchen Daniel 6-1-1 Comparison and Evaluation of Different Monitoring Methods in a Data Center Envi- IPACK2017-74167
Uesugi Kentaro 1-3-2 ronment IPACK2017-74177
Upadhya Girish 1-7-3 Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles IPACK2017-74080
Vaith- Pavan Kumar 2-2-1 IPACK2017-74129
eeswaran Ted 3-3-1 Effects of Cyclic Thermal and Mechanical Loading on Reliability of Solder Based IPACK2017-74191
van Kessel Ted 3-3-2 Interconnects IPACK2017-74225
van Kessel Gilroy 7-1-1 Comparison of Bending Strengths of Si Interposers Determined by PoEF and LoEF IPACK2017-74353
Vandentop Janos 8-3-1 Tests Associated with Acoustic Emission Method IPACK2017-74366
Veres Dietmar 5-7-1 In-situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue IPACK2017-74208
Vogel Milena 1-3-1 Cracks at Die-attached Joints under Cyclic Energization Loading IPACK2017-74082
Vujosevic Milena 2-2-2 POL-kw Modules for High Power Applications IPACK2017-74081
Vujosevic Milena 5-5-1 IPACK2017-74190
Vujosevic Milena 5-5-2 Edge Computing and Contextual Information for The Internet Of Things Sensors IPACK2017-74194
Vujosevic Andrea K. 4-1-1 IPACK2017-74213
Wallace Chun 2-1-2 Investigation of the Heterogeneous Thermal Conductivity Bulk CVD Diamond for IPACK2017-74033
Wang use in Electronics Thermal Management
Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond
for use in Power Electronics 110033
In-situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue
Cracks at Die-attached Joints under Cyclic Energization Loading
State of the Art of Electronics Cooling for Radar Antenna Applications

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal
Interface Materials (TIMs) by a Random Network Model
Monitoring fugitive methane gas emission from natural gas pads

A Robust Low-cost Particulate Sensing System

Innovation and Integration: Industry - University Collaboration

Digital Fabrication for the IOT

Application Driven Reliability Research of Next Generation for Automotive
Electronics: Challenges and Approaches
Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in
BGA Components
Knowledge Based Requirement Calculation for Server BGAs Temperature Cycling
(TC) Qualification
Knowledge based qualification process to evaluate vibration induced failures in
Electronic Components
BGA Temperature Cycling Reliability in Automotive Applications: Knowledge
Based Qualification
3D Wire Bondless Integration- the Future of SiC Packaging

An Advanced Energy Efficient Rack Server Design with Distributed Battery
Subsystem