Page 102 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Suhling Jeffrey 6-1-1 IPACK2017-74231
Suhling Jeffrey 6-1-1 The Effects of Aging on the Cyclic Stress-Strain Behavior and Hysteresis Loop IPACK2017-74274
Suhling Jeffrey 6-1-1 Evolution of SAC+X Solder Materials IPACK2017-74228
Suhling Jeffrey 6-1-1 IPACK2017-74237
Reliability of SAC Solders under Combined Temperature-Vibration Automotive
Environments

Effects of Test Temperature and Prior Aging Conditions on the Creep Properties of
SAC305 Solder Joints

Characterization of IMCs in Sn-Ag-Cu Solder Joints using Nanoindentation

Suhling Jeffrey 6-1-1 Failure Mechanisms of MEMS Gyroscopes Subjected to Operation Under IPACK2017-74250
Suhling Jeffrey 6-1-1 Simultaneous Temperature and Vibration IPACK2017-74241
Suhling Jeffrey 6-1-1 IPACK2017-74229
Quantitative Analysis of Aging Induced Evolution of IMCs in SAC305 Lead Free
Solder

Mechanical Behavior of Lead Free Solders at High Temperatures

Suhling Jeffrey 6-1-1 Methods for Survivability Assurance of Fine Pitch Electronics subjected to IPACK2017-74323
Suhling Jeffrey 6-1-1 Mechanical Shock up to 25,000g IPACK2017-74313

Moisture Induced Stresses in PBGA Packages

Suhling Jeffrey 6-1-1 Development of Anand Viscoplasticity Parameters for High Strain Rate Mechani- IPACK2017-74257
Suhling Jeffrey 6-1-1 cal Behavior of SACQ Solder IPACK2017-74246

Characterization of Moisture Induced Die Stresses in Flip Chip Packaging

Suhling Jeffrey 6-1-1 Improved Finite Element Modeling Strategies for BGA Packages Subjected to IPACK2017-74230
Suhling Jeffrey 6-1-1 Thermal Cycling IPACK2017-74247
Suhling Jeffrey 6-1-1 IPACK2017-74238
Sun Xiaogang 2-1-1 High Strain-Rate Stress-Strain Behavior of SAC305 Solders Operating at IPACK2017-74295
Sun Xiaoguang 2-1-2 Automotive Underhood Temperatures IPACK2017-74033
Susan Donald 1-5-1 IPACK2017-74436
Finite Element and Experimental Study of the Influence of Poisson?s Ratio on the
Reliability of SAC Lead Free Solders

Design Analysis and Performance Evaluation of a Data Center with Indirect
Evaporative Cooling

An Advanced Energy Efficient Rack Server Design with Distributed Battery
Subsystem

Metallurgical Analyses of Pin-to-Flex Circuit Solder Joints

Tabor Christoper E. 3-4-1 Printed Electronics for Aerospace Applications IPACK2017-74311

Takahashi Yoshikazu 9-5-1 Next-Generation Automotive Electronics: Reliability Challenges IPACK2017-74414

Takaya Ryuji 1-4-1 Relationship between Threshold Current Density of Electromigration Damage IPACK2017-74092
Takayanagi Takeshi 1-3-2 Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line IPACK2017-74177
Talmor Michal 1-7-2 IPACK2017-74107
Tam Qizhan 6-1-1 In-situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue IPACK2017-74120
Tan Si-Cong 4-4-1 Cracks at Die-attached Joints under Cyclic Energization Loading IPACK2017-74103
Tan Si-Cong 6-1-1 IPACK2017-74102
Tandon Shalabh 9-5-1 Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic IPACK2017-74397
Conduction Pumping Device

CFD Modeling and Optimization of Fin Array Packaging Solutions for MicroTher-
moelectric Generator (µTEG) Devices

Numerical Investigation of Low Melting Point Metal Based Latent Thermal Energy
Storage System

Experimental Evaluation on Cooling Capacity of Electrically Driven Hybrid Liquid
Metal and Water Cooling

Next-Generation Automotive Electronics: Reliability Challenges

Tang Jianbo 4-1-4 Fabrication and Characterization of Metallic Paste as Highly Conductive Thermal IPACK2017-74064
Tang Jianbo 6-1-1 Interface Material IPACK2017-74065

Self-Driving Cooling Loop Using Liquid Metal and Volatile Fluid as Hybrid Coolant

Tavakkoli Fatemeh 2-1-1 Design Analysis and Performance Evaluation of a Data Center with Indirect IPACK2017-74295
3-3-1 Evaporative Cooling IPACK2017-74239
Thomas Tony
102 PCA and ICA based Prognostic Health Monitoring of Electronic Assemblies
subjected to Simultaneous Temperature-Vibration Loads