Page 106 - ASME InterPACK 2017 Program
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Authors Index

     LAST NAME  FIRST NAME  SESSION  PAPER TITLE                                                                         PAPER NUMBER
     YUKSEL     ANIL         6-1-1                                                                                       IPACK2017-74424
     Zhang      Chi          1-2-1   Advanced Cooling of 3D ICS with Nanoparticle Packings                               IPACK2017-74090
     Zhang      Chi          6-1-1                                                                                       IPACK2017-74089
     Zhang      Di           1-3-1   Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer                     IPACK2017-74233
     Zhang      Di           5-7-1                                                                                       IPACK2017-74300
     Zhang      Di           6-1-1   Enhanced Boiling Performance in Hierarchical bi-Porous Surfaces                     IPACK2017-74274
     Zhang      Di           6-1-1                                                                                       IPACK2017-74247
     Zhang      Han          1-7-3   Effect of Alloy Composition and Aging on the Survivability of Lead Free Solders in  IPACK2017-74179
     Zhang      Hao          3-2-1   High Temperature Vibration in Automotive Environments                               IPACK2017-74232
     Zhang      Hao          3-2-1   Anand Parameters for SAC305 Alloys after Prolonged Storage Upto 1-Year              IPACK2017-74255
     Zhang      Hao          6-1-1                                                                                       IPACK2017-74259
     Zhang      Jun          2-1-2   Reliability of SAC Solders under Combined Temperature-Vibration Automotive          IPACK2017-74033
     Zhao       Xi           4-1-4   Environments                                                                        IPACK2017-74064
     Zhao       Xi           6-1-1   High Strain-Rate Stress-Strain Behavior of SAC305 Solders Operating at              IPACK2017-74065
     Zhao       Yuan         5-4-1   Automotive Underhood Temperatures                                                   IPACK2017-74344
     Zhou       Feng         4-1-4   The Effect of Surface Texture on Thermal Sensation and Comfort                      IPACK2017-74008
     Zhou       Feng         4-3-1                                                                                       IPACK2017-74112
     Zhou       Feng         6-1-1   Design and Development of Biometric Sensor Wearable Band using Flexible             IPACK2017-74009
                                     Electronics
     Zhou       Yuan         4-1-4   Performance and Operational Reliability of Flexible Power Sources In Foldable       IPACK2017-74064
     Zhou       Yuan         6-1-1   Wearable Electronics Under Stresses Of Daily Motion                                 IPACK2017-74065
     Zhu        Ting         3-2-1   Analysis of Color Shift and Life-Modeling of High Power Warm White pc-LED           IPACK2017-74146
     Zhuang     Shiqiang     3-3-2   Operating in High Temperature-Humidity                                              IPACK2017-74298
     Zhuang     Shiqiang     6-1-1   An Advanced Energy Efficient Rack Server Design WITH DISTRIBUTED BATTERY            IPACK2017-74297
     Ziabari    Amir         1-7-3   SUBSYSTEM                                                                           IPACK2017-74360
     Ziabari    Amir         6-1-1   Fabrication and Characterization of Metallic Paste as Highly Conductive Thermal     IPACK2017-74361
     Zien       Herb         2-1-3   Interface Material                                                                  IPACK2017-74321
     Zumbro     John E.      4-1-1   Self-Driving Cooling Loop Using Liquid Metal and Volatile Fluid as Hybrid Coolant   IPACK2017-74213

                                     Phase Change Material (PCM) Based Thermal Management for Lithium Ion
                                     Batteries
                                     Thermofluidic Characterization of An ?Embedded Microchannel-3D manifold?
                                     Cooling Module for High Heat Flux (1 kW/cm2) Power Electronics Application
                                     Thermal Metamaterials for Heat Flow Control in Electronics

                                     Overcoming Challenges in Microfabrication of Si and SiC-based ?Embedded
                                     Microchannel-3D manifold? Cooling Module for High Heat Flux (1 kW/cm2) Power
                                     Electronics Application
                                     Fabrication and Characterization of Metallic Paste as Highly Conductive Thermal
                                     Interface Material
                                     Self-Driving Cooling Loop Using Liquid Metal and Volatile Fluid as Hybrid Coolant

                                     Mechanical Reliability of PECVD SiNx Barrier Films for Flexible Electronics

                                     Point Of Care Micro Biochip For Health Care Monitoring.

                                     Point Of Care Micro Biochip For Health Care Monitoring.

                                     Quasi Ballistic Thermal Transport in InGaAs Alloy

                                     Sub-diffraction Thermoreflectance Imaging of Nanoscale Metal Interconnects

                                     The "Server of the Future" that is Commercially Available Today

                                     3D Wire Bondless Integration- the Future of SiC Packaging

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