Page 105 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Xu Shanshan 1-7-3 IPACK2017-74123
Xu Shanshan 2-3-1 Thin Thermal Ground Planes for High Power-Density Applications IPACK2017-74292
Xuan Yi 1-7-3 IPACK2017-74360
Xuan Yi 6-1-1 Capillary Evaporation in 4-layer Copper Mesh Structure IPACK2017-74361
Yadav Vikas 1-3-1 IPACK2017-74233
Yadav Vikas 6-1-1 Quasi Ballistic Thermal Transport in InGaAs Alloy IPACK2017-74274
Yadav Vikas 6-1-1 IPACK2017-74257
Yagoobi Jamal 1-7-2 Sub-diffraction thermoreflectance imaging of nanoscale metal interconnects IPACK2017-74107
Yalamarthy Ananth Saran 4-3-2 IPACK2017-74318
Yang Hanry 1-2-1 Effect of Alloy Composition and Aging on the Survivability of Lead Free Solders in IPACK2017-74308
Yang Ronggui 2-3-1 High Temperature Vibration in Automotive Environments IPACK2017-74292
Yang Xiao-Hu 4-4-1 Reliability of SAC Solders under Combined Temperature-Vibration Automotive IPACK2017-74103
Yang Xiao-Hu 6-1-1 Environments IPACK2017-74102
Yates Luke 4-1-3 Development of Anand Viscoplasticity Parameters for High Strain Rate Mechani- IPACK2017-74152
Yates Luke 4-1-3 cal Behavior of SACQ Solder IPACK2017-74163
Yates Luke 6-1-1 Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic IPACK2017-74167
Yazawa Kazuaki 6-1-1 Conduction Pumping Device IPACK2017-74361
Yazzie Kyle 1-1-1 Temperature-dependent Thermoelectric Properties of AlGaN/GaN Films Grown IPACK2017-74342
Yin Liang 4-2-1 on Inverted Pyramid Si Structures IPACK2017-74169
Yin Sabrina 2-3-2 Effect of Interfacial Incompatibility on Copper Pumping and Reliability of 3D IPACK2017-74154
Yoda Minami 2-1-4 Electronic Devices IPACK2017-74108
Yousefzadi Ali 2-2-1 Capillary Evaporation in 4-layer Copper Mesh Structure IPACK2017-74113
Nobakht Ali 2-3-2 IPACK2017-74109
Yousefzadi Dahm 1-7-1 Numerical Investigation of Low Melting Point Metal Based Latent Thermal Energy IPACK2017-74057
Nobakht Hongbin 3-4-1 Storage System IPACK2017-74320
Yu Hongbin 6-1-1 Experimental Evaluation on Cooling Capacity of Electrically Driven Hybrid Liquid IPACK2017-74161
Yu Xingjian 1-1-1 Metal and Water Cooling IPACK2017-74195
Yu Xingjian 1-7-1 Impact of Buffer Layers on the Reliability of GaN on Si HEMTs for Power IPACK2017-74196
Yu Bin 6-1-1 Electronics IPACK2017-74102
Yu ANIL 1-7-2 Investigation of the Heterogeneous Thermal Conductivity Bulk CVD Diamond for IPACK2017-74137
Yuan use in Electronics Thermal Management
YUKSEL Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond
for use in Power Electronics
Sub-diffraction Thermoreflectance Imaging of Nanoscale Metal Interconnects

Evaluation and Selection of Adhesives for Opto-Electronic Components

High Bismuth Alloys as Lead-Free Alternatives for Interconnects in High-Tempera-
ture Electronics
Steerable Jumping-Droplet Phase-Change Electronics Cooling

Experimentally Validated Computational Fluid Dynamics Model for Data Center
with Active Tiles
Diversion of Heat Flow in Supported Graphene Nanomeshes

Control of Thermal Transport in Graphene/Si Heterostructures

Pressure Drop and Heat Transfer Characteristics of Wavy Plate Fins for the
Low-Reynolds Number flow
Inkjet Printing of Electrochromic Films On Flexible and Stretchable Substrate for
Wearable Electronics Applications
Planar Strain Mapping of Ball Grid Array Interconnects Using Au Thin Film
Diffraction Gratings
Color Uniformity Enhancement of White Light-emitting Diodes with Bell Shape
Phosphor Layer
Optimization of Filling Mass Fraction for Composite PCMs Based Thermal
Management System
Experimental Evaluation on Cooling Capacity of Electrically Driven Hybrid Liquid
Metal and Water Cooling
Advanced Cooling of 3D ICs with Nanoparticle Packings

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