Page 99 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Schierning Gabi 6-2-1 IPACK2017-74217
Schlorb Heike 6-2-1 Integrated Micro-Thermoelectric Cooling for Silicon Photonics: Modeling and IPACK2017-74217
Schlottig Gerd 2-3-1 Fabrication by Template-Assisted Electrochemical Deposition IPACK2017-74122
Schmadlak Ilko 5-7-2 Integrated Micro-Thermoelectric Cooling for Silicon Photonics: Modeling and IPACK2017-74073
Schmalen- Paul 4-3-1 Fabrication by Template-Assisted Electrochemical Deposition IPACK2017-74112
berg Wayde 1-4-1 Dual-Side Heat Removal by Micro-Channel Cold Plate and Silicon-Interposer with IPACK2017-74306
Schmidt Katharine 8-2-1 Embedded Fluid Channels IPACK2017-74385
Schmidtke Harry 4-2-1 Methods for Theoretical Assessment of Delamination Risks in Electronic IPACK2017-74169
Schoeller David 3-3-2 Packaging IPACK2017-74150
Schwartz Ethan 1-7-1 Thermal Metamaterials for Heat Flow Control in Electronics IPACK2017-74309
Scott Sayan 4-1-1 IPACK2017-74213
Seal Debbie 4-3-2 Challenges in 3D Printing of High Conductivity Copper IPACK2017-74318
Senesky Debbie 6-1-1 IPACK2017-74315
Senesky Gu 1-5-1 Increasing Datacenter Bandwidth: A Technology or a Packaging Issue? IPACK2017-74026
Seonmo Ashkan 2-1-4 IPACK2017-74337
Seyedi Mark J. 2-2-2 High Bismuth Alloys as Lead-Free Alternatives for Interconnects in High-Tempera- IPACK2017-74105
Seymour Mark J. 2-2-2 ture Electronics IPACK2017-74339
Seymour Dave 4-2-1 RF Energy Harvesting Peel-and-Stick Sensors IPACK2017-74169
Shaddock Jimil M. 2-1-3 IPACK2017-74331
Shah Jimil M. 6-1-1 Thermal Boundary Resistance-limited Performance of High-Frequency Photodi- IPACK2017-74370
Shah Krishna 4-4-1 odes IPACK2017-74418
Shah Mohak 9-5-1 3D Wire Bondless Integration - the Future of SiC Packaging IPACK2017-74400
Shah Sohil 2-1-2 IPACK2017-74019
Shah Ali 1-7-3 Temperature-dependent Thermoelectric Properties of AlGaN/GaN Films Grown IPACK2017-74360
Shakouri Ali 6-1-1 on Inverted Pyramid Si Structures IPACK2017-74361
Shakouri Bofeng 1-1-1 Rapid Prototyping of High-temperature Multi-functional AlGaN/GaN Sensors using IPACK2017-74195
Shang Bofeng 1-7-1 Laser Ablation and Direct Wire Bonding IPACK2017-74196
Shang Sandeep 5-7-2 Large Flip Chip Assembly Challenges and Risk Mitigation Process IPACK2017-74073
Shantaram Rajnish 2-3-2 IPACK2017-74119
Sharma Ying 1-4-1 Concurrent DWDM Silicon Photonic Interconnect Driven by a Quantum Dot Comb IPACK2017-74306
She Laser
Comparison and Evaluation of Different Monitoring Methods in a Data Center Envi-
ronment
Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles

High Bismuth Alloys as Lead-Free Alternatives for Interconnects in High-Tempera-
ture Electronics
CFD Simulation and Optimization of the Cooling of Open Compute Machine Learn-
ing “BIG SUR” Server
CFD Simulation and Optimization of the Cooling of Open Compute Machine Learn-
ing “BIG SUR” Server
In-Situ Thermal Characterization of Lithium-Ion Batteries

Next-Generation Automotive Electronics: Reliability Challenges

NiyanTron - An Approach to Develop a Control System App for Data Center
Cooling
Quasi Ballistic Thermal Transport in InGaAs Alloy

Sub-Diffraction Thermoreflectance Imaging of Nanoscale Metal Interconnects

Color Uniformity Enhancement of White Light-emitting Diodes with Bell Shape
Phosphor Layer
Optimization of Filling Mass Fraction for Composite PCMs Based Thermal
Management System
Methods for Theoretical Assessment of Delamination Risks in Electronic
Packaging
Experimental Investigation of Parameters Affecting Performance of Pulsating Heat
pipes
Challenges in 3D Printing of High Conductivity Copper

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