Page 9 - ASME AM3D/IDETC/CIE 2015 Program
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IDETC/CIE
STUDENT ACTIVITIES AM3D

ASME Innovative Design Simulation (IDSC) DEC Student Competition: Designing for
Challenge the Future

Sunday, August 2, 2015 Monday, August 3, 2015
8:00am – 5:00pm Session: DEC-4-1
4:10pm – 5:50pm
Location: Room 210, Level 2
Location: Room 105, Level 1
The ASME Innovative Design Simulation (IDSC) Challenge is a unique
forum that provides mechanical engineering and multi-disciplinary Designing for the Future is an undergraduate design competition organized
undergraduate students around the world an opportunity to demonstrate by the Design Education Technical Committee (DEC) of the ASME Design
their creativity, organization, analysis, synthesis, and software skills, and Engineering Division (DED). It is to recognize that our undergraduates are
to demonstrate the engineering process from the perspective of the future of the engineering profession, and highlights the importance of
modeling and simulation for product or process design. Students will working together in our diverse world community and the importance of
showcase their knowledge and creativity to address a broad spectrum of appropriate stewardship of our resources as technology continues to move
academic, industrial, manufacturing, and humanitarian challenges. forward. The DEC believes that encouraging the undergraduates in design
activities is critical to our mission of improving education in the art and the
The top 12 entries (as chosen by a panel of judges) are invited to science of mechanical engineering design, thus providing the students an
present their simulations and/or simulation environments and incentive to continue in design and become the researchers, educators,
compete for 6 awards of $2,000 in three software-based design and professional design practitioners of the future.
simulation categories to a panel of judges at the ASME 2015
International Design Engineering Technical Conference and
Computers and Information in Engineering Conference (IDETC/CIE) MSNDC Student Paper Competition
and Additive Manufacturing + 3D Printing Conference and Expo
(AM3D) in Boston, MA, USA. The faculty advisors of the winner stu- Tuesday, August 4, 2015
dents are also announced and recognized through $1,000 and 5 Session: MSNDC-20-1
years of complimentary ASME membership. 11:40am – 12:40pm
Location: Room 300, Level 3
The ASME Innovative Additive The Technical Committee on Multibody Systems and Nonlinear
Manufacturing 3D (IAM3D) Challenge Dynamics and Sound (MSND) is sponsoring a Student Paper
Competition, as part of the 11th International Conference on Multibody
Sunday, August 2, 2015 Systems, Nonlinear Dynamics, and Control (MSNDC).

8:00am – 5:00pm
Location: Room 207, Level 2 Student Networking Event and Team Design
Competition
All are invited to attend the finals of the ASME’S Innovative Additive
Manufacturing 3D (IAM3D) Challenge. Meet the 15 undergraduate Tuesday, August 4, 2015
engineering/technology student finalist teams vying for five (5) 5:30pm – 7:00pm
$2,000 awards each in the Best Overall Design, Best Innovation,
and Best Re-engineered/Multidisciplinary Collaboratively Designed Location: Innovation Alley, Exhibit Hall C, Level 2
Product; Best Freshman Design and Best Verbal Presentation. The After a busy day of attending technical presentations we invite you to join
faculty advisor of the five (5) winning student/teams also win a us for a student networking event and design competition. Meet old and
$1,000 award and 5 years of complimentary ASME membership. new friends and engage in a 30-minute competitive design experience

The IAM3D Challenge is designed to give mechanical and multi-dis- that will give you a chance to exercise your creativity and work as a team.
ciplinary undergraduate students around the world an opportunity to Snacks will be provided and gift cards will be given to the winners!
re-engineer existing products or create new designs that minimize
energy consumption and/or improve energy efficiency. Students will VIB Student Paper Competition
showcase their creativity by demonstrating the value added through
their ingenuity, by the application of sound engineering design Dates, Times, and Locations Vary. See technical sessions for more
principles, and by leveraging Additive Manufacturing technology to information.
address a broad spectrum of industrial, manufacturing, and humani-
tarian challenges. The IAM3D Challenge also emphasizes the value The Technical Committee on Vibration and Sound (VIB) is sponsor-
of an ability to deliver a clear, concise and effective oral presentation. ing a Student Paper Competition, as part of the 27th Conference on
Mechanical Vibration and Noise (VIB). Awards will be presented to
the top 3 student papers.


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