Page 10 - ASME AM3D/IDETC/CIE 2015 Program
P. 10
AM3D AM3D 2015 CHAIR’S WELCOME
This great event would not have been possible without the help of a
dedicated Executive Advisory Board, and I am indebted to them for
AM
AM ADDITIVE all of their support and assistance. Specifi cally, I would like to thank:
MANUFACTURING
3D
Kevin Creehan, America Makes
3D + PRINTING John Hart, MIT
Conference & Expo
Agnes Kulcha, United Technologies
Brandon Lane, NIST
Emerging trends and applications in
DIGITAL MANUFACTURING AND DESIGN Frank Liou, Missouri University
Hello and welcome to the 2015 ASME Additive Manufacturing + Ivan Madera, MORF3D
3D Printing (AM3D) Conference, the inaugural event in a new Ed Morris, America Makes
series of conferences focusing on digital manufacturing and design
innovation! David Rosen, Georgia Institute of Technology
Given all of the hype surrounding 3D printing, we decided to focus Brian Rosenberger, Lockheed Martin
this inaugural conference on “the engineering behind additive John David Rowatt, Schlumberger
manufacturing” and create an industry-focused event that explores
how additive manufacturing is reshaping how we design, make, and Tim Shinbara, AMT
qualify parts. Zack Simkin, Senvol
We secured an impressive list of thought leaders and practitioners Krishnan Suresh, University of Wisconsin-Madison
from both industry and academia to discuss their views on the real
challenges and opportunities of additive manufacturing (AM). Darrell Wallace, Youngstown State University
The conference begins by discussing the economics behind AM Xiaoping Yang, Cummins
and use cases for AM and then moves into candidate part selection
and design tools for AM. Participants will witness live demos of the
latest software tools and technologies for AM design and topology Finally, I would also like to thank ASME for the excellent staff support
optimization and for AM process modeling and simulation, which is for this event, particularly Israr Kabir who kept us on track, on time,
becoming more and more critical for successful AM fabrication. and on task this past year. I am also grateful to all the logistical and
Materials and processing challenges will be highlighted by those administrative help we received from Raj Manchanda, Erin Dolan,
working in a range of industries, and we wrap up with industry and Mary Jakubowski at ASME, and from Jeff Rhoads and his team
leaders discussing techniques for part qualifi cation and non-de- of organizers for accommodating AM3D into the 2015 ASME
structive inspection. IDETC/CIE conferences.
We have also arranged to have several thought-provoking panels We hope you enjoy the AM3D conference and learn all you need
during the conference, including discussions on standards for AM, know about the engineering behind AM!
materials development for AM, and future directions of AM and 3D
printing as envisioned by several pioneers in the fi eld.
Timothy W. Simpson
The opening keynotes by Bruce Bradshaw (Stratasys), Jason
Lopes (Legacy Effects), and Hod Lipson (Columbia University) are Chair, AM3D Executive Advisory Committee
sure to capture your attention and imagination, and we encourage Pennsylvania State University
you to visit more than 30 exhibitors highlighting the latest equip-
ment, software, and technology during the event.
10
This great event would not have been possible without the help of a
dedicated Executive Advisory Board, and I am indebted to them for
AM
AM ADDITIVE all of their support and assistance. Specifi cally, I would like to thank:
MANUFACTURING
3D
Kevin Creehan, America Makes
3D + PRINTING John Hart, MIT
Conference & Expo
Agnes Kulcha, United Technologies
Brandon Lane, NIST
Emerging trends and applications in
DIGITAL MANUFACTURING AND DESIGN Frank Liou, Missouri University
Hello and welcome to the 2015 ASME Additive Manufacturing + Ivan Madera, MORF3D
3D Printing (AM3D) Conference, the inaugural event in a new Ed Morris, America Makes
series of conferences focusing on digital manufacturing and design
innovation! David Rosen, Georgia Institute of Technology
Given all of the hype surrounding 3D printing, we decided to focus Brian Rosenberger, Lockheed Martin
this inaugural conference on “the engineering behind additive John David Rowatt, Schlumberger
manufacturing” and create an industry-focused event that explores
how additive manufacturing is reshaping how we design, make, and Tim Shinbara, AMT
qualify parts. Zack Simkin, Senvol
We secured an impressive list of thought leaders and practitioners Krishnan Suresh, University of Wisconsin-Madison
from both industry and academia to discuss their views on the real
challenges and opportunities of additive manufacturing (AM). Darrell Wallace, Youngstown State University
The conference begins by discussing the economics behind AM Xiaoping Yang, Cummins
and use cases for AM and then moves into candidate part selection
and design tools for AM. Participants will witness live demos of the
latest software tools and technologies for AM design and topology Finally, I would also like to thank ASME for the excellent staff support
optimization and for AM process modeling and simulation, which is for this event, particularly Israr Kabir who kept us on track, on time,
becoming more and more critical for successful AM fabrication. and on task this past year. I am also grateful to all the logistical and
Materials and processing challenges will be highlighted by those administrative help we received from Raj Manchanda, Erin Dolan,
working in a range of industries, and we wrap up with industry and Mary Jakubowski at ASME, and from Jeff Rhoads and his team
leaders discussing techniques for part qualifi cation and non-de- of organizers for accommodating AM3D into the 2015 ASME
structive inspection. IDETC/CIE conferences.
We have also arranged to have several thought-provoking panels We hope you enjoy the AM3D conference and learn all you need
during the conference, including discussions on standards for AM, know about the engineering behind AM!
materials development for AM, and future directions of AM and 3D
printing as envisioned by several pioneers in the fi eld.
Timothy W. Simpson
The opening keynotes by Bruce Bradshaw (Stratasys), Jason
Lopes (Legacy Effects), and Hod Lipson (Columbia University) are Chair, AM3D Executive Advisory Committee
sure to capture your attention and imagination, and we encourage Pennsylvania State University
you to visit more than 30 exhibitors highlighting the latest equip-
ment, software, and technology during the event.
10
