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Types and parameters of PIR boards
XPS INSULATION BOARDS
Stem type Rigid polyisocyanurate (PIR) foam
Apparent core thickness ρ = 30 (+6/-2) kg/m 3
Declared thermal conductivity coefficient from 0.022 W/(m·K) depending on the cladding type and thickness *
Boards made of extruded polystyrene (XPS) are recommended for insulating loaded places such
AL – aluminium
PK – KRAFT paper formed through direct foaming and extrusion. as foundations, car parks, garages or industrial
WS – glass veil Their specific cellular structure ensures perfect floors, as well as placed exposed to damp, such
Board cladding ETX – glass veil thermal properties. Leading properties of XPS as inverted roofs for instance.
BT – bituminous cladding
AGRO AL – aluminium 50 mikrons boards include high compression strength and
AGRO P – agro aluminium multi-layer laminate water resistance. Because of that, it is particularly
Standard board dimensions 1200 x 2400 mm and 1200 x 600 mm
Dimensions of boards on request 1200 x 1200 mm / 1200 x 3600 mm / 1200 x 6000 mm / 1200 x max 12000 mm
FIT – flat milling cutter, LAP – step milling cutter,
Milling types XPS INSULATION BOARDS
TAG – cope and patter set milling cutter **
Board thickness [mm] board thicknesses between 20 mm and 250 mm at 10 mm distances KEY PROPERTIES

Compression strength at 10% deformation σ ≥ 120 – 150 kPa (depending on board thickness)
10
4 perimeter insulation of walls below ground level 4 insulation of roads, railway and tram tracks
Fire reaction classification E – self-extinguishing – for AGRO AL, AL, WS, ETX 4 Insulation of floors and floor covers 4 insulation of terraces, loggias and balconies,
(board itself) F – for others
4 insulation of wall footing and foundation slabs 4 insulation of elements of agricultural, farm and
4 insulation of roofs with classical and inverted layer animal stock buildings
* All information on the insulation properties of the boards is available on www.termoorganika.pl
** Milling: LAP available for boards from 30 mm, TAG for boards from 40 mm. Cover area of LAP and TAG milled boards is 15 mm smaller. layout 4 insulation of places where the risk of thermal
4 insulation of traffic routes and car parks bridges may occur

Types of PIR boards

λ D – declared thermal
conductivity coefficient
λ 0.029 – 0.036* W/(m·K) lambda [W/(m·K)].
D
termPIR PK term PIR WS, ETX termPIR AL
(KRAFT paper) (glass veil) (aluminium)

termPIR AGRO AL termPIR BT termPIR AGRO P
(aluminium 50 mikrons) (bituminous cladding) (aluminium multi-layer laminate)

PIR AND XPS

* depending on board type and thickness

EXTERNAL THERMAL INSULATION COMPOSITE SYSTEM EPS PLASTERS PAINTS ADHESIVES 19