Page 13 - PowerPoint Presentation

ASTUTE COUNTERFEIT AVOIDANCE

PROGRAMME

Over $1m investment by Astute in test equipment. ACAP is an on going investment and as our
customers requirements change and the processesof detection improve so will our equipment.

High Powered Microscopy
Detailed surface inspection. Including lead condition, print form
and texture analysis.

Marking Permanency & Dynasolve
To confirm the original part markings evident and no shadow
markings after DPA, scrape test to check for black topping

ED XRF Spectrometry
Analysis of termination finish. Elemental composition of
component materials.

Real Time X-Ray
Check for lot consistency of internal construction.

De Cap/ Lidding- Chemical & Physical
Observation of Die marks, topography and indicators of re-work /
poor quality.

Scanning Electron Microscopy (SEM)
Observational analysis of component features, including mapping
of elements present. Combats coating free re-marking techniques.

Solderability Testing
Force Measurement test (wetting balance), method IPC/EIA
J-STD-002.

Diagnosys
Dynamic electrical test, providing
rapid detection of counterfeit devices
including wrong die, incorrect
functionality, electrostatic charge and
both short and open circuit failures.
Supplier Control Process
ACAP has been developed over 30 years of trading, working
alongside government bodies in Europe & the USA and gathering
data from a network of global portals. Astute are the partner of choice
for many of the world’s leading electronics manufacturers.