Page 7 - Heroes of Chemistry Program Booklet

ACS honors DuPont Electronics & Imaging for Chemical Mechanical Planarization
(CMP), a key process in semiconductor fabrication, which supplies the advanced chips

needed for smartphones, computing, the internet of things, vehicles, and numerous
industrial applications. The CMP process, enabled by DuPont’s CMP pads, has contributed
to the success of semiconductor technology for well over 35 years.

William Budinger
William (Bill) Budinger was critical to the development of the IC1000™ CMP pad family. Now retired,
Budinger was one of the founders of Rodel, which was acquired by Rohm and Haas, became part
of Dow, and is now the basis of the CMP business at DuPont.

Marty DeGroot
Marty DeGroot is R&D Director for DuPont Industrial Solutions. Marty has 15 years’ experience in
industrial materials innovation, including the fields of catalysis, solar cells/modules, and chemical
mechanical planarization technologies to enable advanced semiconductor nodes. He has a Ph.D. in
Chemistry, 30 granted U.S. patents, and more than 25 publications.

David James
David James was a R&D Manager at Dow/Rohm and Haas. Now retired, he led a team that
demonstrated a lower modulus polyurethane polymer for better contact and an increase in copper
film removal rate. He also coordinated scale-up and manufacturing of the first offerings in the
VisionPad™ pad family.

MaryJo Kulp
MaryJo Kulp was a Senior Scientist at Dow/Rohm and Haas. Now retired, Kulp developed and
proved a polymeric hypothesis that resulted in the basis of the VisionPad™ CMP pad family.
Offerings from the VisionPad™ family played a critical enabling role for the introduction of copper
damascene integration.

2020 Recipients | #HeroesofChemistry 7