Page 9 - ASME IDETCCIE 2017 Program

Welcome Letters

IDETC/CIE

37TH COMPUTERS AND INFORMATION IN ENGINEERING CONFERENCE (CIE)

The Computers and Information in Engineering Division of ASME welcomes all IDETC/CIE Conference participants to the 37th Annual Computers
and Information in Engineering Conference (CIE). This conference is a premier formal for international exchange of technical, scientific, and
application knowledge related to the theory and practice of computing to support engineering activities. As such, this broad conference is
organized around the four Technical Committees of the CIE Division:

• Advanced Modeling and Simulation (AMS) • Systems Engineering and Information Knowledge Management
o Seung Ki Moon, Chair (SEIKM)
o Krishnanand Kaipa, Vice Chair o Ashis Banerjee, Chair
o David Jensen, Vice Chair
• Computer Aided Product and Process Design (CAPPD)
o Chi Zhou, Chair • Virtual Environments and Systems (VES)
o John Stueben, Vice Chair o Robert Wendrich, Chair
o Pramita Mitra, Vice Chair

We welcome conference participants to become involved with our technical committees. Please contact the TC chair or vice chair or feel free
to attend the TC committee meeting which will be held 6:00–7:00pm Tuesday evening. These meetings will be immediately followed by the CIE
Division meeting which is also an open meeting. Room locations are announced in the program.

This conference provides a forum for researchers, practitioners, educators, and students from industry, academe, and government research labs
to share their latest findings and challenges with the broader research community, foster collaborations, and build a sustainable research
community.

The conference organizing team is pleased to report that there are 103 accepted papers from 136 submitted full papers. A total of 95 papers

• Advanced Modeling and Simulation (AMS) General • CAPPD: Emotional Engineering
• CAPPD: Human Modeling: Methods and Applications in Engineering
• Computer-Aided Product and Process Development (CAPPD) • Design for Resilience and Failure Recovery (with Design Automation
General
Conference)
• Virtual Environments and System (VES) General • SEIKM: Design Informatics
• SEIKM: Knowledge Capture, Reuse, and Management
• Systems Engineering, Information and Knowledge Management • SEIKM: Systems Engineering
(SEIKM) General • SEIKM: Smart Manufacturing Infomatics
• VES: Methods, Processes and Strategies
• AMS: Simulation in Advanced Manufacturing

• AMS: Uncertainty Quantification in Simulation and Model Verification
& Validation

• AMS: Computational Multiphysics Applications

• AMS/SEIKM/CAPPD: Design, Simulation and Optimization for
Additive Manufacturing

were ultimately submitted and accepted which are organized into 15 symposiums consisting of 25 total sessions:

Additionally, we have organized five panels of leading experts in their respective fields to provide discussions and forums for current topics
of relevance:

• VES Panel: Advancement in Digital Technology Systems, • CIE Panel: From a Researcher/Technology Developer to an
Usage of VR and Tools for Design Engineering Advanced Technology Visionary/Facilitator – A Perspective

• AMS Panel: Additive Manufacturing in Aerospace, Defense and • CIE Panel: Manufacturing Today
Automotive Industries: Status and Promises

• SEIKM Panel: Smart and Connected Vehicles – Coming Soon to a
Place Near You!

We are also delighted to offer an Industry Presentation session entitled Computer and Information Technology Trends, as well as a poster session 9
for graduate students to afford them the opportunity to present their current work to the research community and get their feedback on Tuesday
Afternoon. The graduate student posters also will be on display throughout the conference, so please feel free to stop by and talk with our future
colleagues.

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