Page 2 - ASME ISPS 2016 Program
P. 2

Steering Committee



                         Chair’s Welcome Message



                         On behalf of the conference steering committee it is our pleasure to welcome you to the
                         inaugural ASME IoT Connect Conference, featuring the InterPACK Pathfinder Workshop, and
                         the 21st Information Storage and Processing Systems (ISPS) Conference. All attendees will
                         have the opportunity to address challenges, explore solutions, and establish new connections.

                         IOT Connect brings together thought leaders from both industry and research community to
                         explore the latest in IoT hardware across the spectrum from edge devices to data centers,
                         establish new directions for heterogeneous on-package integration, and review strategic
                         research roadmaps. What makes IoT Connect unique is a program that centers on the
                         physical component, sub-systems, and infrastructure that empowers the cloud to exist and
                         operate with intelligence. Without continued holistic advancement from chip design, data
                         centers, micro-systems, packaging, and sensors, progress cannot be made toward realizing
                         the promise of IoT. Hardware design must complement and continuously co-evolve with
                         software development to offer complete solutions. IoT Connect speakers will share their best
                         engineering practices for creating IoT optimized hardware.
                         Over the course of two full days, the IoT Connect program will cover six topics: Data Center
                         and Telecom, Information Storage, MEMS/NEMS, Packaging, System & Security, and Thermal.
                         In addition, four exciting keynote talks are planned. Conference day one will feature Scott
                         Scheeler, VP, Switching Hardware, Cisco, and Steve Campbell, CTO, Western Digital. The
                         keynote speakers on the second day will be Tom Bradicich, VP & GM, Servers & IoT Systems,
                         Hewlett Packard Enterprise, and Ken Hansen, President and CEO, Semiconductor Research
                         Corporation (SRC). Two main panel sessions are planned at the conclusion of each day.

                         This event would not have been possible without the dedication of our volunteer organizers
                         who worked tirelessly to create a program consisting of over 70 invited eminent speakers
                         who are shaping the technology roadmap of IoT hardware.
                         We hope you find this conference valuable in gaining knowledge, reconnecting with your
                         network, and establishing new relationships. Collaboration between various disciplines will
                         be essential to successfully transitioning to a connected world—we thank you, the attendees,
                         for your participation, which helps us to take the next step in this journey.












                                                                                                 Gamal Refai-Ahmed
                                                                                                 Xilinx

                                                                                                 IoT General Chair








           22









          ISPS/IOT/IPW Program-june16r4.indd   2                                                                         6/9/16   2:08 PM
   1   2   3   4   5   6   7