Page 3 - ASME ISPS 2016 Program

IoT Connect

Chair’s Welcome Message

On behalf of the many technical program volunteers it is my pleasure to welcome you to the
inaugural AMSE IoT conference being held June 20-21 at the Santa Clara Marriott in the heart
of Silicon Valley.
The IoT Connect conference has three programs- IoT hardware enablement – The 25th
annual Information Storage and Process Systems Program (ISPS) and the InterPACK
Pathfinder Workshop Program – with whom we share four keynote speakers and two panel
sessions to connect the broad range of skillsets and the many disciplines that must come
together to realize the promise of the Internet of Connected Hardware - the IoT.
The key differentiator of the ASME IoT conference is the focus on the hardware required to
build out the IoT. While most events focus on The Cloud, Software, Applications and IT
infrastructure, ASME’s IoT conference, puts the T in IoT – we focus on the design, develop-
ment and manufacture of the Things – the Intelligent Hardware from Sensors to Edge
Computing to Servers and Data Centers. The ASME IoT Conference brings together
Manufacturers, Researchers, Communications Specialists and Business Leaders to explore
IoT hardware from the component to the system level.

Engaging presenters, both industry leaders and academic researchers will illuminate the path
to the world of IoT with presentations on MEMS/NEMS, Packaging, Thermal, Storage, Data
Center and of course the increasingly mission critical topic of Security.
My sincere thanks to the many volunteers on the technical committees, all industry leaders in
their own right, who recruited top flight speakers and developed the program to ensure the
highest quality of presentations on the most relevant topics.
I hope you are as excited as I am to attend this timely and relevant conference on the
hardware design and development challenges to realize the objectives of the IoT.

Ivor Barber
Xilinx
IoT Program Chair

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