Page 9 - ASME ISPS 2016 Program

Networking Activities and
Committee Meetings

Binghamton University Small Scale Systems Integration and Packaging Please join your 2016 conference organizers and division leadership for ISPS CONFERENCE BANQUET
(S3IP) Center of Excellence numerous networking and learning opportunities… Witness creative and Monday, June 20th
inventive technical talks at the Keynote Breakfasts and Lunches each day. 6:30pm – 9:30pm
The S3IP, comprising five constituent research Enjoy cocktails and light hors d’oeuvres Monday evening at the Sedona Room
centers and two laboratories (available for conference reception and end the day by honoring your fellow attendees
industry use), solves practical problems for and engineers at the ISPS Awards Banquet. *TICKETS ARE REQUIRED AND CAN BE PURCHASED AT THE
electronics industry partners. Its industrial REGISTRATION DESK FOR $50
member-driven research portfolio and The ISPS conference banquet will recognize the exceptional
experience base in thermal management, manufacturing materials, failure achievements and dedication of the numerous leaders within the
analysis, reliability improvement, and energy efficiency for electronic Tickets and/or Badges are required. Information Storage & Processing Systems community. The evening will
systems underpins improvements in the manufacturing of microelectronic
KEYNOTE BREAKFASTS begin with a distinguished lecture by Roger Wood of Western Digital.
products, commercialization of flexible printed electronic technology,
Daily The award ceremony will include award presentations to winners of the
development of advanced batteries and energy harvesting devices, and
8:00am – 9:15am Best Paper in each track as well as the ISPS Student Fellowships and
improvements in the energy efficiency of data centers.
Grand Ballroom BCD Conference Scholarships.
For more information please visit the website: www.binghamton.edu/s3ip/

KEYNOTE LUNCHEONS
Daily
Xilinx
12:45pm – 2:15pm
Xilinx is the world’s leading provider of All Grand Ballroom BCD
Programmable FPGAs, SoCs, MPSoCs and
3D ICs, enabling the next generation of
smarter, connected, and differentiated
COFFEE NETWORKING BREAKS
systems and networks. Driven by the industry-wide shifts towards Cloud
Daily
Computing, SDN/NFV, Video Everywhere, Embedded Vision, Industrial
11:00am – 11:15am and 3:45pm – 4:00pm
IoT, and 5G Wireless, Xilinx innovations enable these applications that are
Grand Ballroom Foyer
both, software defined, yet hardware optimized.
For more information please visit the website: www.xilinx.com
OPENING RECEPTION
Monday, June 20th
SILVER 6:00pm – 6:30pm
Grand Ballroom Foyer
University of Texas at Arlington Electronics, MEMS & Nanoelectronics
Systems Packaging Center]
The Agonafer Group at the COMMITTEE MEETINGS
University of Texas at Arlington Monday, June 20th
has two centers. The first is The 6:00pm – 7:00pm
Center for Energy-Smart Electronic & Photonic Packaging Division
Electronic Systems (ES2) which is a National Science Foundation Industry/ Monterey Room
University Cooperative Research Center (I/UCRC) established to develop
methodologies for efficiently operating electronic systems, including data
centers, by controlling resources and managing workloads to achieve
Tuesday, June 21st
optimal energy consumption. The second is an Electronic Packaging
3:45pm – 5:45pm
Center that addresses reliability of microelectronics from packages to
Information Storage & Processing Systems Division
boards.
Monterey Room
For more information please visit the website: http://emnspc.uta.edu/

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