Page 117 - ASME IDETCCIE 2017 Program
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Tuesday Technical Program

                                                                                                                                IDETC/CIE

DESIGN OF A RECONFIGURABLE DYNAMIC TESTBED FOR                             DESIGN AND FABRICATION OF 3D PRINTED TISSUE SCAFFOLDS
CO-DESIGN METHOD VALIDATION                                                INFORMED BY MECHANICS AND FLUIDS SIMULATIONS
Technical Paper Publication. DETC2017-67319                                Technical Paper Publication. DETC2017-67602

Anand Deshmukh, University of Illinois at Urbana Champaign, Urbana, IL,    Paul Egan, Veronica Gonella, Max Engensperger, Stephen J Ferguson,
USA, Danny Lohan, University of Illinois at Urbana-Champaign,              Kristina Shea, Swiss Federal Institute of Technology ETH Zurich, Zurich,
Champaign, IL, USA, James Allison, University of Illinois at Urbana-       Switzerland
Champaign, Urbana, IL, USA
                                                                           TOPOLOGY OPTIMIZATION FOR ADDITIVE MANUFACTURING
NESTED AND SIMULTANEOUS SOLUTION STRATEGIES FOR GENERAL                    CONSIDERING LAYER-BASED MINIMUM FEATURE SIZES
COMBINED PLANT AND CONTROLLER DESIGN PROBLEMS                              Technical Paper Publication. DETC2017-68383
Technical Paper Publication. DETC2017-67668
                                                                           Mikhail Osanov, Johns Hopkins University, Baltimore, MD, USA, James
Daniel Herber, University of Illinois at Urbana-Champaign, Champaign, IL,  Guest, Johns Hopkins University, Lutherville Timonium, MD, USA
USA, James Allison, University of Illinois at Urbana-Champaign, Urbana,
IL, USA                                                                    EXPEDITING BUILD TIME, MATERIAL, AND COST ESTIMATION FOR
                                                                           MATERIAL EXTRUSION PROCESSES TO ENABLE MOBILE
UNIFIED SCALING OF DYNAMIC OPTIMIZATION DESIGN                             APPLICATIONS
FORMULATIONS                                                               Technical Paper Publication. DETC2017-68230
Technical Paper Publication. DETC2017-67676
                                                                           Shantanab Dinda, The Pennsylvania State University, State College, PA,
Daniel Herber, University of Illinois at Urbana-Champaign, Champaign, IL,  USA, Devansh Modi, Timothy W. Simpson, Penn State University,
USA, James Allison, University of Illinois at Urbana-Champaign, Urbana,    University Park, PA, USA, Saish Tedia, Christopher Williams, Virginia Tech,
IL, USA                                                                    Blacksburg, VA, USA

OPTIMAL SENSOR PLACEMENT METHODS FOR ACTIVE POWER                          DAC-7-1: DESIGN FOR MARKET SYSTEMS

ELECTRONIC SYSTEMS                                                         CONCOURSE LEVEL, ROOM 6  4:00PM–5:40PM
Technical Paper Publication. DETC2017-68253
                                                                           Session Organizer: Scott Ferguson, North Carolina State University,
Satya R T Peddada, University of Illinois at Urbana Champaign, Urbana,     North Carolina, NC, USA
IL, USA, Pamela Tannous, University of Illinois at Urbana-Champaign,
Urbana, IL, USA, Andrew G. Alleyne, University of Illinois at Urbana-      Session Co-Organizer: Kenneth Mark Bryden, Iowa State University,
Champaign, Urbana, IL, USA, James Allison, University of Illinois at       Ames, IA, USA
Urbana-Champaign, Urbana, IL, USA

DAC-6-2: DESIGN FOR ADDITIVE                                               DESIGN FOR MARKETING MIX: THE PAST, PRESENT, AND FUTURE OF
MANUFACTURING 2                                                            MARKET-DRIVEN PRODUCT DESIGN
                                                                           Technical Paper Publication. DETC2017-68275
CONCOURSE LEVEL, ROOM 8       4:00PM–5:40PM
                                                                           Joseph Donndelinger, Baylor University, Waco, TX, USA, Scott Ferguson,
                                                                           North Carolina State University, North Carolina, NC, USA

Session Organizer: Timothy Simpson, Pennsylvania State University,         TWO-STAGE MODELING OF CUSTOMER CHOICE PREFERENCES IN
University Park, PA, USA
                                                                           ENGINEERING DESIGN USING BIPARTITE NETWORK ANALYSIS
Session Co-Organizer: Georges Fadel, Clemson University, Clemson, SC,      Technical Paper Publication. DETC2017-68099
USA
                                                                           Jiawei Sophia Fu, Northwestern University, Evanston, IL, USA, Zhenghui
COST MINIMIZATION IN METAL ADDITIVE MANUFACTURING USING                    Sha, University of Arkansas, Fayetteville, AR, USA, Yun Huang,
CONCURRENT STRUCTURE AND PROCESS OPTIMIZATION                              Northwestern University, Evanston, IL, USA, Mingxian Wang, Ford Motor
Technical Paper Publication. DETC2017-67836                                Company, Dearborn, MI, USA, Yan Fu, Ford Motor Company, Bloomfield
                                                                           Hills, MI, USA, Wei Chen, Northwestern University, Evanston, IL, USA
Runze Huang, Erva Ulu, Carnegie Mellon University, Pittsburgh, PA, USA,
Levent Kara, Carnegie Mellon University, Pittsburgh, PA, USA, Kate S.      AGENT BASED MODELING OF AUTOMOBILE PRODUCER AND
Whitefoot, Carnegie Mellon University, Pittsburgh, PA, USA                 CONSUMER BEHAVIOR TO SUPPORT DESIGN FOR MARKET SYSTEMS
                                                                           ANALYSIS
OPTIMIZATION OF LATTICE INFILL DISTRIBUTION IN ADDITIVE                    Technical Paper Publication. DETC2017-68351
MANUFACTURING
Technical Paper Publication. DETC2017-67582                                Amineh Zadbood, Steven Hoffenson, Stevens Institute of Technology,
                                                                           Hoboken, NJ, USA
Francesco Campagna, Politecnico di Torino, Torino, Italy, Alejandro R.
Diaz, Michigan State University, East Lansing, MI, USA

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