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FEED LINE BASICS                                                        287



            Meanwhile, in microstrip line, the largest portion of the same current concentrates on the lower
            surface faced the ground plane that thereby increases its density and Ohmic loss. Besides, the
            EM energy density is higher and field diameter in microstrip line is bigger than in similar
            stripline that increases the dielectric loss and reduces the maximum power handling. In spite of
            it, both lines provide excellent electrical performance up to 30 - 40 GHz, depending upon the
            choice of PCB materials and production technology.
            f) An embedded microstrip line. The copper trace on the surface of the PCB is often covered
            by an additional dielectric layer to protect the trace from corrosion or isolate it from other traces
            printed on the top (additional trace in gray).

            g) An inverted microstrip line. Evidently, it is less lossy and less dispersive than conventional
            microstrip line but more challenging and costly to produce. The dominant mode is practically
            TEM because the role of the thin substrate is to support the trace only.

            h) A  suspended microstrip line.  This line  with small thickness  substrate  is the  apparent
            modification of a lower loss suspended stripline. The production cost is higher because it is
            based on a quite sophisticated and not cheap multiple vias technologies.
            k) A slotline [8] was proposed in 1968 by American engineer S. B. Cohn, relatively easy and
            inexpensive to fabricate, and found broad applications in Microwave Integrated Circuit (MIC)
            and Monolithic MIC (MMIC). Apparently, the central portion of propagating along the line EM
            energy is concentrated in the area of the small gap between two traces printed on the top of the
            dielectric substrate. The E-field vector is mostly oriented across the slot and, by definition, the
            dominant mode is a quasi-TEM. The energy of this mode is divided between two mediums of
            different dielectric constant. Therefore, the slotline should be quite dispersive. Moreover, a high
            concentration of electrical and magnetic fields around the sharp edges of traces (edge effect
            described in Section 3.3.3 of Chapter 3) causes the extremely high density of electrical current
            there. In other words, the conductor losses dominate and the slot line is lossier than microstrip
            line. The same effect of E-field concentration seriously restricts the power handling.
            l) An antipodal or offset slotline. The primary and almost exclusive application of this line is
            the feed of ultra-wideband (one antenna can cover the frequency band from 1 GHz to 40 GHz)
            antipodal Vivaldi antenna printed on PCB. Such kind of antennas are part of systems with
            spread spectrum signals, unique types of radars emitting ultra-short pulses, etc.
            m) A bilateral or double-sided slotline. The line has two identical slots printed on both sides
            of the substrate. The top and bottom parts of slot traces, i.e. left and right, are bonded. The main
            idea of this line is to split the EM energy between two slots thereby reducing Ohmic loss and
            improving power handling.

            n) A microstrip and slotline assembly. Such combination of two types of lines allows designing
            a broadband transition between two lines.

            p) A CoPlanar Waveguide (CPW). CPW consists of a signal trace between two ground traces
            printed on the top surface of  the  substrate.  It may  be considered  as a  transformation  of a
            conventional slotline into a symmetrical structure. As a result, the fringe fields in the air are
            relatively small,  most of  EM energy is concentrated  in dielectric, and consequently the
            dispersion is low. To accumulate the fields in the substrate area and to minimize the leakage
            and crosstalk, the dielectric constant of the substrate is typically chosen relatively high (10 or
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