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PA01019111_inh_EN.pdf
Wafer Grippers
Wafer Grippers SWGm
PA01019111_inh_EN.pdf Two suction areas suitable for wafer sizes 125 x 125 mm and 156 x 156 mm PA01019111_inh_EN.pdf
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Schmalz - The Company Suitable for Industry Specific Applications
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Applications
Vacuum Knowledge • Wafer gripper for extremely fast and gentle handling of wafers
and solar cells in the production processes
• Loading and unloading from stacks and conveyor belts
Vacuum Suction Cups • Exact positioning during the visual inspection and position
measurement allow for on-the-fly breakage detection during the
handling process
• Fully or partially automated production of PV cells with maximum
Special Grippers process stability, production line uptime, cell efficiency and line
output
Vacuum Grip- ping Systems Wafer grippers SWGm Design
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• Base model version with discharging exhaust air (3) in axial (A) or
Mounting Elements • Suction area geometries available in common cell sizes 125 mm
lateral (S) direction
and 156 mm (5" and 6")
• Optional component (II) for controlled discharging of exhaust air
Vacuum Generators • Modular design with accessories for the mounting of sensors and
modules for suction and damping (I) and a selection of flange
modules (III)
• Minimal overall height through reduced-weight plastic design
Valve Technology System design wafer grippers SWGm • Replaceable contact surfaces
Switches and Monitoring container Our Highlights... Your Benefits...
• Low overall height and
operating weight >High speed, high accuracy
handling for cycle times
below one second
Filters and Connections • Optimum allocation and >Less operating cost
dimension of the suction
points
• High suction rate even for >Reliable gripping and
Services partial coverage or leakages handling, even for deformed,
broken or perforated wafers
• Exhaust air channels for >No contamination of process
controlled air discharge area
Contact Wafer grippers SWGm being used for handling solar cells • Quick object release >Precise positioning and very
short cycle times
• Gripper surface made of PEEK >Minimal surface contamina-
(Polyetheretherketone) tion of the wafer and
Index of Products reduction of blind spots
340 www.schmalz.com/swgm
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PA01019111_inh_EN.pdf