Page 594 - Wago_PCB_TerminalBlocksConnectors_Volume2_2015_US

Tests and Testing Procedures per IEC/EN Standards (continued)
13 Electrical Tests (continued)
592
• Voltage Drop Test per IEC/EN 60947-7-1, IEC/EN 60999-1

The Voltage Drop Test evaluates clamping point quality under stresses such as vibrations, temperature changes and corrosive
influences, in order to verify that the contact point is gas-tight.

Test arrangement: “Voltage Drop Test”

Example: Current load cycling test result for Combi PCB terminal blocks with IDC and PUSH WIRE connections
®
Voltage drop variation over longer periods under current load cycling conditions is shown for 251-3xx Combi PCB terminal
blocks using solid copper conductors. The diagram shows that the voltage drop is constant, far beyond the 192 cycles required
in IEC/EN 60998-2-2.

IDC connections using 0.5 mm (20 AWG) solid copper conductor
2

24
22
20
Voltage drop per clamping unit in mV 16
18
14
12
10
8
6
4
2
0
0 48 96 144 192 240 288 336 384 432 480 528 576 624 672 720 768 816 864 912 960 1000
Cycles (1 cycle: 0.5 h 6 A / 0.5 h 0 A)
Clamp. unit 1 Clamp. unit 2 Clamp. unit 3 Clamp. unit 4

PUSH WIRE connections using 0.5 mm (20 AWG) solid copper conductor
®
2

24
22
20
Voltage drop per clamping unit in mV 16
18
14
12
10
8
6
4
2 (The voltage drop was determined at rated current)
0
0 48 96 144 192 240 288 336 384 432 480 528 576 624 672 720 768 816 864 912 960 1000
Cycles (1 cycle: 0.5 h 6 A / 0.5 h 0 A)
Clamp. unit 1 Clamp. unit 2 Clamp. unit 3 Clamp. unit 4