Page 8 - AtecomProductCatalogue

Customized your high quality wafers

GaAs Wafer

Parameters
Diameter 50.8 ~ 150 mm
Dopant N / Si P / Zn SI / Carbon
Thickness 350 ~ 675 μm
Surface Orientation On-axis : (100) ± 0.5º degree
2
Hall Mobility ≥1000 ~ 2500 ≥50 ~ 120 ≥4000~5000 cm /V.S
Etch Pit Density ≤100 ~ 5000 ≤ 3000 ~ 5000 ≤ 1500 ~ 5000 cm -2
Carrier Concentration (0.8 ~ 4.0) x 10 18 (0.5 ~ 5.0) x 10 19 ≤ 1 x 10 8 cm -3

TTV SSP : ≤ 10 / DSP : ≤ 4 μm
Warp ≤ 15 μm
Surface Etched or Polished
* Low EPD for LD application is also available

InP Wafer

Parameters
Diameter 50.8 ~ 100 mm
Orientation (100) ± 0.5° degree
Thickness 350 ~ 625 μm
Type / Dopant N / S or Sn P / Zn N / Undoped

Carrier Concentration (0.8-8) x 10 18 (1-10) x 10 15 cm -3
2
Mobility (1-2.5) x 10 3 50 ~ 100 (3-5) x 10 3 cm /Vs
Etch Pitch Density 100 ~ 5000 ≤ 500 ≤ 5000 cm 2
TTV SSP : ≤ 10 / DSP : ≤ 4 μm
Warp ≤ 15 μm
Surface Etched or Polished

Germanium Wafers

Parameters
Diameter 50.8 ~ 100 mm
Dopant P / Ga N / As

Resistivity 0.005 ~ 0.04 0.05 ~ 0.25 Ω.cm

Orientation (100) ± 0.5 degree

Thickness 175 ~ 625 μm
Etch Pit Density ≤ 300 cm -2
TTV ≤ 10 μm
Warp ≤ 15 μm
Surface Etched / SSP / DSP

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