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Optical Receivers                                                                  223


                                             18   ‒3
                                 8nm InGaAs:5 × 10 cm       50nm i-InAlAs
                                 2.5nm i-AlAs etch          50nm i-InAlGaAs (graded)
                                 17nm i-InAlAs              1μm InGaAs absorption
                          HEMT   5nm i-InAlAs               100nm         InP:Fe
                                                       MSM
                                                                         18
                                                                             ‒3
                                 20nm i-InGaAs              8nm InGaAs:5 × 10 cm Si
                                 5nm i-InAlAs               2.5nm i-AlAs etch stop
                                 25nm i-InAlAs:Fe           17nm i-InAlAs
                                 1μm InP:Fe barrier/etch    5nm i-InAlAs
                           MSM   5nm i-InGaAs etch          20nm i-InGaAs
                                 50nm i-              HEMT  5nm i-InAlAs
                                 50nm i-InAlGaAs            25nm i-InAlAs:Fe
                                 1μm InGaAs                 50nm InP:Fe
                                 50nm InP:Fe                InP:Fe substrate
                                 InP:Fe substrate
                                         (a)                         (b)
                   Figure 5.27  Schematic structure of (a) HEMT/MSM and (b) MSM/HEMT. Adapted from [54].



                                    HEMT                           MSM-PD
                                                                  Interdigitated
                             S       G        D     InGaAs
                                                   contact layer
                                                                InAlAs barrier layer
                                                   Delta-doped
                                                   pseudomorphic
                                 In 0.63 Ga 0.47 As  In 0.76 Ga 0.26 As  Absorption layer
                                                   channel with a
                                                   InAlAs spacer
                                  InAlAs buffer
                                                  InP substrate


                    Figure 5.28  MSM and HEMT grown in parallel. Information for schematic taken from [57].



           and 12 pA/Hz 1∕2  were obtained for bandwidths of 6.3, 8, and 13.7 GHz, respectively in [55]. The noise per-
           formance of a receiver in the case of a digital signal is usually defined by its sensitivity, or the minimum
           detectable signal power in the presence of noise for a particular bit error rate (BER). As standard practice,
           a BER of 10 −9  is used for characterization of most receivers. For example, the sensitivity of an InP-based
           MSM-HEMT photoreceiver described in [57] is measured to be −10.7 dBm at 10 Gb/s with 1 μm spacing of
           the MSM electrodes. The noise performance is frequently shown by eye diagrams. The more open the eye is,
           the better is the noise performance and, hence, the inter-symbol interference (ISI) is less.
            Although the performance of InP-based structures is very good, the electronic device technology is more
           established for GaAs-based structures. This significantly reduces their cost. Thus, GaAs-based structures are
           more popular and attractive for commercial applications. Also, compared with pin-PDs, MSM-PDs have the
           advantage of high intrinsic bandwidth, ultra-low capacitance, and easy planar integrability with HEMTs and
           HBTs [59, 60].
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