Page 166 - GIGABYTE Service Manual-v3.0-110101
P. 166
03. Apply few solder on the joint during heating.
04. Heat the joint around IO by soldering iron to help the solder to melt.
Figure 11-40: I/O Removing-2
11.4.10 I/O Soldering
01. Fix IO chip on the PCB by tweezers; make sure the contact area between pins and
pads is enough. If not adjust the position of IO chip by tweezers. (Still keep heating by
heat gun)
Figure 11-41: I/O Soldering -1
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