Page 163 - GIGABYTE Service Manual-v3.0-110101

11.4.7 MOSFET Removing

01. Add few flux on soldering joint.
02. Heat PCB by heat gun. (According the operation rules of flux, the heating must

continue more than 30 seconds. The distance between PCB and tuyere must be more
than 20 mm.)
-1

Figure 11-33: MOSFET Removing-1

03. Heat MOSFET pins by soldering iron to help solder melting on the joint.
(For big ground or two ounce copper design, this is the way to prevent PCB from being
yellowish due to overheating.)

Figure 11-34: MOSFET Removing-2

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