Page 158 - GIGABYTE Service Manual-v3.0-110101

11.4 Soldering Iron Operation

01. Daily Maintenance of Soldering Iron.
02. Two Pad Components Removing (RCL).
03. Two Pad Components Soldering (RCL).

04. Three Pad Components Removing (Transistor).
05. Three Pad Components Soldering (Transistor).
06. MOSFET Removing.
07. MOSFET Soldering.
08. Multi Pad Components Removing (I/O).

09. Multi Pad Components Soldering (I/O).
Refer to IPC-A-610D for the details of SMT soldering standard.
Any flux applied must be cleaned completely.

11.4.1 Maintenance

How to maintain:
- To prevent the soldering iron tip from burn out, the tip must be covered by solder all

the time, unless it’s in use.
- Remove the excess solder on the tip by wet sponge, not by knocking the soldering
iron.
- Switch off the power of soldering iron if not used in more than one hour.

- Do not press the heating button over 20 seconds for TQ-90.
- Do not set the temperature over 400 ℃ for adjustable temperature controlled
soldering station. Regulator component soldering temperature setting is 350 ±20 ℃.

Figure 11-22: Remove excess solder on tip by wet sponge

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