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Panel Sessions
CIE-7-1 – PANEL
Additive Manufacturing in Aerospace, Defense and Automotive
Industries: Status and Promises
Tuesday, August 8
8:00am–9:00am
Room 5 linking performance to material properties through mechatronic/robotic
This CIE-AMS panel will discuss the opportunities and challenges on
designing and developing new components with high quality for
aerospace, defense, and automotive industries using various 3D printing
or additive manufacturing (AM) technologies. AM offers numerous
advantages including the capability of producing sophisticated and
customizable components, multi-material utilization, reduction in
production time and flexibility to be used for the variety of repairs, and
freeform fabrication. In particular, the industries also want to explore new
designs for functional components and sensors for Industry 4.0 and
Internet of Things using AM technologies (Design for AM). These design
methods need to be applicable to not only future products, but also current
products. And this research provides an indication of the “optimal” design
for a given product with respect to cost, including quality control, materials,
features, manufacturing, testing and inspection, maintenance, etc. The
panelists will focus one R&D investments in public-private partnerships,
R&D Roadmap, market maturity, industry best practices, the role of
standards in AM, and quality control management.
PANELISTS
Timothy W. Simpson
Penn State University
Biography: Dr. Simpson is the Paul Morrow Professor of Engineering
Design and Manufacturing at Penn State. He has affiliations in Information
Sciences & Technology and Architecture and is the co-Director of CIMP-3D
(www.cimp-3d.org). He has been PI or Co-PI on over $25M in funding for
his research in additive manufacturing and 3D printing, product family and
product platform design, and multidisciplinary design optimization, and he
has published over 300 peer-reviewed papers and edited two textbooks.
He has collaborated on projects with a variety of companies, including
Bayer Material Science, Boeing, GE, GM, LG, LORD Corporation,
Schlumberger, United Launch Alliance, United Technologies, and Volvo.
He teaches courses on Mechanical Design, Industrial Systems Design,
Concurrent Engineering, Product Family Design, and Additive
Manufacturing. He is a recipient of the ASME Ben C. Sparks Award, the
ASEE Fred Merryfield Design Award, and a NSF Career Award. He is a
Fellow in ASME and an Associate Fellow in AIAA. He is Chair of the ASME
Design, Manufacturing, and Materials Segment Leadership Team and is
Past Chair of the ASME Design Engineering Division (DED) Executive
Committee. He helped ASME launch the Innovative Additive Manufac-
turing 3D (IAM3D) Design Challenge in 2014 and served as Chair of the
Executive Advisory Committee for the 2015 and 2016 ASME Additive
Manufacturing and 3D Printing Conference. He received his Ph.D. and
M.S. degrees in Mechanical Engineering from Georgia Tech and his B.S. in
Mechanical Engineering from Cornell.
IDETC/CIE
John Michopoulos
Naval Research Laboratory
Biography: As the head of Computational Multiphysics Systems Lab at the
Naval Research Laboratory (NRL) at Washington D.C., Dr. Michopoulos
oversees multi-physics modeling and simulation research efforts, including
establishing the science behind additive manufacturing processes and
data and specification-driven methodologies. He pioneered the develop-
ment of the robotic multiaxial testing for the data-driven inverse multi-scale
characterization of anisotropic materials. He is currently the principle
investigator of a new grand challenge effort on “The Science of Layered
Deposition Processes for Novel Materials” involving four divisions at NRL.
His participation in this panel will reflect his insight as developed
throughout this program.
He has authored and co-authored more than 260 publications and is
the co-inventor of 9 inventions. He is a fellow of the ASME and has been
honored with numerous international and national awards including the
P.S. Theocharis award from the National Academy of Athens, the 2014
Innovator of the Year award from Wolfram Inc, the 2015 Research
Excellence award by ASME’s CIE division and several best paper awards
from the ASME’s CIE division for papers presented in CIE conferences.
He holds a M.Sc. in Civil Engineering and a Ph.D. in Applied Mathematics
and Mechanics from the National Technical University of Athens, and has
pursued post-doctoral studies at Lehigh University on computational multi-
field modeling of continua and Fracture Mechanics.
CIE-20-1 – SEIKM PANEL
Smart and Connected Vehicles – Coming Soon to a Place Near You!
Tuesday, August 8
11:00am–12:00pm
Room 5
We live in a connected world today surrounded by a network of personal
mobile devices, electronic gadgets and appliances, smart buildings, and
finally automobiles – seamlessly connected and integrated into a smart
technology ecosystem called the Internet of Things (IoT). With a variety of
infotainment services and connected car applications for drivers, the
automotive industry is becoming an IoT champion. However, IoT has a
bigger role in the automotive industry than just enhancing end customer
experiences. This panel will focus on how IoT is revolutionizing traditional
auto manufacturing processes such as design, material, assembly, and
quality control – while also enabling personalized in-car experiences and
services that enhance the connected lifestyle of customers, including their
broader safety, health and wellness. The panel will include members from
both industry and academia who would share their visions as well as foster
lively discussions on the growing importance of IoT in various domains of
the transportation industry over the coming years, especially as self-driving
cars hit the road.
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